Inventor

LIEW KEIN FEE

MY2 patents

Patents

2 patents

US8384223B2Feb 26, 2013

Backside mold process for ultra thin substrate and package on package assembly

INTEL CORP2 citations54

US8835220B2Sep 16, 2014

Backside mold process for ultra thin substrate and package on package assembly

INTEL CORP0 citations43