Inventor

HSU CHING KUO

TW2 patents

Patents

2 patents

US10566279B2Feb 18, 2020

Package device, semiconductor device, and method for manufacturing the package device

ADVANCED SEMICONDUCTOR ENG4 citations68

US10424539B2Sep 24, 2019

Wiring structure, semiconductor package structure and semiconductor process

ADVANCED SEMICONDUCTOR ENG2 citations68