Inventor
BRECHIGNAC RéMI
FR3 patents
Patents
3 patentsUS9006904B2Apr 14, 2015
Dual side package on package
ST MICROELECTRONICS GRENOBLE 21 citations47
US9076749B2Jul 7, 2015
Electronic system comprising stacked electronic devices comprising integrated-circuit chips
ST MICROELECTRONICS GRENOBLE 20 citations36
US9196590B2Nov 24, 2015
Perforated electronic package and method of fabrication
ST MICROELECTRONICS GRENOBLE 20 citations31