Inventor
LEE RUOJIA
US42 patents
Patents
42 patentsUS5250450AOct 5, 1993
Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
MICRON TECHNOLOGY INC166 citations99
US5241496AAug 31, 1993
Array of read-only memory cells, eacch of which has a one-time, voltage-programmable antifuse element constructed within a trench shared by a pair of cells
MICRON TECHNOLOGY INC262 citations99
US5122848AJun 16, 1992
Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
MICRON TECHNOLOGY INC263 citations99
US5013680AMay 7, 1991
Process for fabricating a DRAM array having feature widths that transcend the resolution limit of available photolithography
MICRON TECHNOLOGY INC461 citations99
US5331196AJul 19, 1994
One-time, voltage-programmable, logic element
MICRON TECHNOLOGY INC92 citations96
US5266510ANov 30, 1993
High performance sub-micron p-channel transistor with germanium implant
MICRON TECHNOLOGY INC73 citations96
US5252504AOct 12, 1993
Reverse polysilicon CMOS fabrication
MICRON TECHNOLOGY INC83 citations96
US5177030AJan 5, 1993
Method of making self-aligned vertical intrinsic resistance
MICRON TECHNOLOGY INC67 citations96
US5126290AJun 30, 1992
Method of making memory devices utilizing one-sided ozone teos spacers
MICRON TECHNOLOGY INC57 citations96
US5037773AAug 6, 1991
Stacked capacitor doping technique making use of rugged polysilicon
MICRON TECHNOLOGY INC83 citations96
US4981810AJan 1, 1991
Process for creating field effect transistors having reduced-slope, staircase-profile sidewall spacers
MICRON TECHNOLOGY INC58 citations96
US5286993AFeb 15, 1994
One-sided ozone TEOS spacer
MICRON TECHNOLOGY INC35 citations93
US5257238AOct 26, 1993
Dynamic memory having access transistor turn-off state
MICRON TECHNOLOGY INC35 citations93
US5240796AAug 31, 1993
Method of fabricating a chromeless phase shift reticle
MICRON TECHNOLOGY INC47 citations93
US5241206AAug 31, 1993
Self-aligned vertical intrinsic resistance
MICRON TECHNOLOGY INC36 citations93
US5208176AMay 4, 1993
Method of fabricating an enhanced dynamic random access memory (DRAM) cell capacitor using multiple polysilicon texturization
MICRON TECHNOLOGY INC40 citations93
US5196364AMar 23, 1993
Method of making a stacked capacitor dram cell
MICRON TECHNOLOGY INC22 citations93
US5192872AMar 9, 1993
Cell structure for erasable programmable read-only memories
MICRON TECHNOLOGY INC29 citations93
US5155057AOct 13, 1992
Stacked v-cell capacitor using a disposable composite dielectric on top of a digit line
MICRON TECHNOLOGY INC23 citations93
US5149665ASep 22, 1992
Conductive source line for high density programmable read-only memory applications
MICRON TECHNOLOGY INC43 citations93
US5089867AFeb 18, 1992
High control gate/floating gate coupling for EPROMs, E2 PROMs, and Flash E2 PROMs
MICRON TECHNOLOGY INC39 citations93
US5077225ADec 31, 1991
Process for fabricating a stacked capacitor within a monolithic integrated circuit using oxygen implantation
MICRON TECHNOLOGY INC34 citations93
US5069747ADec 3, 1991
Creation and removal of temporary silicon dioxide structures on an in-process integrated circuit with minimal effect on exposed, permanent silicon dioxide structures
MICRON TECHNOLOGY INC41 citations93
US5023190AJun 11, 1991
CMOS processes
MICRON TECHNOLOGY INC39 citations93
US4924119AMay 8, 1990
Electrically programmable erasable inverter device with deprogramming limitation
MICRON TECHNOLOGY INC27 citations93
US5371701ADec 6, 1994
Stacked delta cell capacitor
MICRON TECHNOLOGY INC43 citations92
US5026657AJun 25, 1991
Split-polysilicon CMOS DRAM process incorporating self-aligned silicidation of the cell plate, transistor gates, and N+ regions
MICRON TECHNOLOGY INC33 citations92
US5321285AJun 14, 1994
Carrier injection dynamic random access memory having stacked depletion region in Mesa
MICRON TECHNOLOGY INC38 citations91
US5227321AJul 13, 1993
Method for forming MOS transistors
MICRON TECHNOLOGY INC43 citations89
US5024961AJun 18, 1991
Blanket punchthrough and field-isolation implant for sub-micron N-channel CMOS devices
MICRON TECHNOLOGY INC36 citations87
US6787428B2Sep 7, 2004
Aluminum-filled self-aligned trench for stacked capacitor structure and methods
MICRON TECHNOLOGY INC11 citations82
US5321648AJun 14, 1994
Stacked V-cell capacitor using a disposable outer digit line spacer
MICRON TECHNOLOGY INC17 citations82
US5321649AJun 14, 1994
Stacked delta cell capacitor
MICRON TECHNOLOGY INC10 citations74
US5266513ANov 30, 1993
Method of making stacked W-cell capacitor
MICRON TECHNOLOGY INC15 citations74
US5236855AAug 17, 1993
Stacked V-cell capacitor using a disposable outer digit line spacer
MICRON TECHNOLOGY INC11 citations74
US5219778AJun 15, 1993
Stacked V-cell capacitor
MICRON TECHNOLOGY INC10 citations74
US5066606ANov 19, 1991
Implant method for advanced stacked capacitors
MICRON TECHNOLOGY INC9 citations74
US7057285B2Jun 6, 2006
Aluminum interconnects with metal silicide diffusion barriers
MICRON TECHNOLOGY INC5 citations73
US6720605B1Apr 13, 2004
Aluminum-filled self-aligned trench for stacked capacitor structure and methods
MICRON TECHNOLOGY INC6 citations73
US6465319B1Oct 15, 2002
Aluminum-filled self-aligned trench for stacked capacitor structure and methods
MICRON TECHNOLOGY INC4 citations73
US6165863ADec 26, 2000
Aluminum-filled self-aligned trench for stacked capacitor structure and methods
MICRON TECHNOLOGY INC6 citations73
USRE35828EJun 23, 1998
Anti-fuse circuit and method wherein the read operation and programming operation are reversed
MICRON TECHNOLOGY INC1 citations52