Inventor
GALL THOMAS P
US20 patents
⚠️ This page may combine multiple inventors who share the name “GALL THOMAS P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US5391514AFeb 21, 1995
Low temperature ternary C4 flip chip bonding method
IBM79 citations96
US5442144AAug 15, 1995
Multilayered circuit board
IBM25 citations92
US5359767ANov 1, 1994
Method of making multilayered circuit board
IBM24 citations92
US5679444AOct 21, 1997
Method for producing multi-layer circuit board and resulting article of manufacture
IBM21 citations91
US5374344ADec 20, 1994
Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate
IBM13 citations73
US5709805AJan 20, 1998
Method for producing multi-layer circuit board and resulting article of manufacture
IBM11 citations72
US5379193AJan 3, 1995
Parallel processor structure and package
IBM14 citations72
US5403420AApr 4, 1995
Fabrication tool and method for parallel processor structure and package
IBM15 citations70
US5363553ANov 15, 1994
Method of drilling vias and through holes
IBM7 citations68
US5347710ASep 20, 1994
Parallel processor and method of fabrication
IBM6 citations62
MOTOROLA INC
5 patentsUS6927344B1Aug 9, 2005
Flexible circuit board assembly
MOTOROLA INC100 citations97
US6483037B1Nov 19, 2002
Multilayer flexible FR4 circuit
MOTOROLA INC75 citations96
US6501661B1Dec 31, 2002
Electronic control unit
MOTOROLA INC36 citations91
US7075794B2Jul 11, 2006
Electronic control unit
MOTOROLA INC22 citations89
US6749105B2Jun 15, 2004
Method and apparatus for securing a metallic substrate to a metallic housing
MOTOROLA INC4 citations63
TEMIC AUTOMOTIVE NA INC
3 patentsUS7570492B2Aug 4, 2009
Apparatus for venting an electronic control module
TEMIC AUTOMOTIVE NA INC7 citations70
US7353983B2Apr 8, 2008
Vertical removal of excess solder from a circuit substrate
TEMIC AUTOMOTIVE NA INC0 citations38
US7300820B2Nov 27, 2007
Adhesive assembly for a circuit board
TEMIC AUTOMOTIVE NA INC0 citations36