Inventor
HECK HOWARD L
US29 patents
⚠️ This page may combine multiple inventors who share the name “HECK HOWARD L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
17 patentsUS6672902B2Jan 6, 2004
Reducing electromagnetic interference (EMI) emissions
INTEL CORP19 citations89
US9559905B2Jan 31, 2017
Type-C retimer state machine and a protocol for inband control and configuration
INTEL CORP10 citations84
US10386941B2Aug 20, 2019
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP5 citations83
US10978407B2Apr 13, 2021
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
INTEL CORP2 citations73
US10158339B2Dec 18, 2018
Capacitive compensation structures using partially meshed ground planes
INTEL CORP2 citations73
US9875210B2Jan 23, 2018
Method and apparatus of USB 3.1 retimer presence detect and index
INTEL CORP2 citations73
US10996773B2May 4, 2021
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP3 citations72
US10079158B2Sep 18, 2018
Vertical trench routing in a substrate
INTEL CORP3 citations69
US12372574B2Jul 29, 2025
Skew detection and compensation for high speed I/O links
INTEL CORP0 citations62
US11422642B2Aug 23, 2022
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations61
US11061492B2Jul 13, 2021
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations61
US9525441B2Dec 20, 2016
Common mode noise introduction to reduce radio frequency interference
INTEL CORP2 citations60
US11614811B2Mar 28, 2023
Gyratory sensing system to enhance wearable device user experience via HMI extension
INTEL CORP0 citations57
US9489333B2Nov 8, 2016
Adaptive termination scheme for low power high speed bus
INTEL CORP0 citations52
US9326380B2Apr 26, 2016
Universal serial bus hybrid footprint design
INTEL CORP0 citations52
US9800001B2Oct 24, 2017
Rate scalable connector for high bandwidth consumer applications
INTEL CORP1 citations51
US9552995B2Jan 24, 2017
Electrical interconnect for an electronic package
INTEL CORP0 citations51
IBM
5 patentsUS5301118AApr 5, 1994
Monte carlo simulation design methodology
IBM110 citations98
US5620782AApr 15, 1997
Method of fabricating a flex laminate package
IBM59 citations95
US5384690AJan 24, 1995
Flex laminate package for a parallel processor
IBM61 citations95
US5509196AApr 23, 1996
Method of fabricating a flex laminate package
IBM24 citations91
US5347710ASep 20, 1994
Parallel processor and method of fabrication
IBM6 citations62
JAUSSI JAMES E
4 patentsUS9106217B2Aug 11, 2015
Width scalable connector for high bandwidth IO interfaces
JAUSSI JAMES E7 citations81
US9654342B2May 16, 2017
Bandwidth configurable IO connector
JAUSSI JAMES E2 citations72
US9362684B2Jun 7, 2016
Rate scalable connector for high bandwidth consumer applications
JAUSSI JAMES E2 citations60
US9804646B2Oct 31, 2017
Host controlled IO power management
JAUSSI JAMES E1 citations51
MOONEY STEPHEN R
3 patentsUS10089270B2Oct 2, 2018
Interchangeable power and signal contacts for IO connectors
MOONEY STEPHEN R3 citations71
US9312908B2Apr 12, 2016
Universal IO connector and interface capable of both wired and wireless operation
MOONEY STEPHEN R2 citations60
US9791905B2Oct 17, 2017
Rate scalable IO interface with zero stand-by power and fast start-up
MOONEY STEPHEN R0 citations50