Inventor
KRESGE JOHN S
US34 patents
⚠️ This page may combine multiple inventors who share the name “KRESGE JOHN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
31 patentsUS6753612B2Jun 22, 2004
Economical high density chip carrier
IBM123 citations98
US5874776AFeb 23, 1999
Thermal stress relieving substrate
IBM107 citations98
US5574630ANov 12, 1996
Laminated electronic package including a power/ground assembly
IBM189 citations98
US5301118AApr 5, 1994
Monte carlo simulation design methodology
IBM110 citations98
US6373717B1Apr 16, 2002
Electronic package with high density interconnect layer
IBM97 citations97
US6351393B1Feb 26, 2002
Electronic package for electronic components and method of making same
IBM71 citations96
US5956235ASep 21, 1999
Method and apparatus for flexibly connecting electronic devices
IBM67 citations96
US5620782AApr 15, 1997
Method of fabricating a flex laminate package
IBM59 citations95
US5384690AJan 24, 1995
Flex laminate package for a parallel processor
IBM61 citations95
US6509546B1Jan 21, 2003
Laser excision of laminate chip carriers
IBM52 citations93
US6829823B2Dec 14, 2004
Method of making a multi-layered interconnect structure
IBM31 citations92
US6720502B1Apr 13, 2004
Integrated circuit structure
IBM17 citations92
US6073344AJun 13, 2000
Laser segmentation of plated through-hole sidewalls to form multiple conductors
IBM29 citations92
US6059579AMay 9, 2000
Semiconductor structure interconnector and assembly
IBM25 citations92
US5509196AApr 23, 1996
Method of fabricating a flex laminate package
IBM24 citations91
US6361923B1Mar 26, 2002
Laser ablatable material and its use
IBM14 citations84
US6341071B1Jan 22, 2002
Stress relieved ball grid array package
IBM16 citations84
US6868604B2Mar 22, 2005
Method for forming an electrical structure
IBM8 citations74
US6689543B2Feb 10, 2004
Laser ablatable material and its use
IBM12 citations74
US6562654B2May 13, 2003
Tented plated through-holes and method for fabrication thereof
IBM7 citations74
US6559388B1May 6, 2003
Strain relief for substrates having a low coefficient of thermal expansion
IBM9 citations74
US6249045B1Jun 19, 2001
Tented plated through-holes and method for fabrication thereof
IBM13 citations74
US6228470B1May 8, 2001
Composite substrate for electronic components
IBM9 citations74
US6203652B1Mar 20, 2001
Method of forming a via in a substrate
IBM9 citations74
US7024764B2Apr 11, 2006
Method of making an electronic package
IBM8 citations73
US6998290B2Feb 14, 2006
Economical high density chip carrier
IBM7 citations73
US6887779B2May 3, 2005
Integrated circuit structure
IBM8 citations73
US6693031B2Feb 17, 2004
Formation of a metallic interlocking structure
IBM7 citations72
US6348737B1Feb 19, 2002
Metallic interlocking structure
IBM8 citations72
US6483074B2Nov 19, 2002
Laser beam system for micro via formation
IBM5 citations63
US5347710ASep 20, 1994
Parallel processor and method of fabrication
IBM6 citations62