Inventor

TAKANO NOZOMU

JP25 patents

⚠️ This page may combine multiple inventors who share the name “TAKANO NOZOMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKANO NOZOMU

HITACHI CHEMICAL CO LTD

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

Thermosetting resin composition and use thereof

Prepreg, metal-clad laminate, and printed circuit board obtained from these

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

Epoxy resin compositions for printed circuit board and printed circuit board using the same

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole

Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same

Method of producing epoxy resin film

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board

Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board

Epoxy composition for printed circuit boards

Method of producing high molecular weight epoxy resin using an amide solvent

Epoxy resin film and method of producing epoxy resin film

Thermosetting resin composition and process for producing the same

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

Thermosetting resin composition and use thereof

Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

TAKEUCHI KAZUMASA

Printed wiring board

TAKANO NOZOMU

Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof

HITACHI CHEMICHAL CO LTD

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board