Inventor
HOFFMAN PAUL ROBERT
US8 patents
Patents
8 patentsUS6737750B1May 18, 2004
Structures for improving heat dissipation in stacked semiconductor packages
AMKOR TECHNOLOGY INC310 citations98
US6759266B1Jul 6, 2004
Quick sealing glass-lidded package fabrication method
AMKOR TECHNOLOGY INC220 citations97
US6603183B1Aug 5, 2003
Quick sealing glass-lidded package
AMKOR TECHNOLOGY INC217 citations97
US6632997B2Oct 14, 2003
Personalized circuit module package and method for packaging circuit modules
AMKOR TECHNOLOGY INC38 citations91
US6630661B1Oct 7, 2003
Sensor module with integrated discrete components mounted on a window
AMKOR TECHNOLOGY INC39 citations91
US6576998B1Jun 10, 2003
Thin semiconductor package with semiconductor chip and electronic discrete device
AMKOR TECHNOLOGY INC32 citations91
US6900527B1May 31, 2005
Lead-frame method and assembly for interconnecting circuits within a circuit module
AMKOR TECHNOLOGY INC6 citations71
US7176062B1Feb 13, 2007
Lead-frame method and assembly for interconnecting circuits within a circuit module
AMKOR TECHNOLOGY INC2 citations60