Inventor

CHU TSE-MING

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHU TSE-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHU KUEI-WU

1 patent

US8299629B2Oct 30, 2012

Wafer-bump structure

CHU KUEI-WU3 citations47

CHU TSE-MING

1 patent

US8937386B2Jan 20, 2015

Chip package structure with ENIG plating

CHU TSE-MING0 citations20