Inventor

OHUCHI SHINJI

JP49 patents

⚠️ This page may combine multiple inventors who share the name “OHUCHI SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OHUCHI SHINJI

OKI ELECTRIC IND CO LTD

Semiconductor device, manufacturing method thereof and aggregate type semiconductor device

Semiconductor device and method for manufacturing the same

Using grooves as alignment marks when dicing an encapsulated semiconductor wafer

Semiconductor device and method of fabricating the same

Bond pad for stress releif between a substrate and an external substrate

Method of manufacturing semiconductor device including semiconductor elements mounted on base plate

Method of making semiconductor device having first and second sealing resins

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

Semiconductor device having first and second sealing resins

Stacked semiconductor device

Resin sealing type semiconductor device

Manufacturing method of stack-type semiconductor device

Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby

Semiconductor device and manufacturing method thereof

Semiconductor device packaged in plastic and mold employable for production thereof

Semiconductor device and method of fabricating the same

Resin-encapsulated semiconductor device

Semiconductor device, manufacturing method thereof and aggregate type semiconductor device

Method of manufacturing semiconductor devices having solder bumps with reduced cracks

Structure for packaging semiconductor chip

Semiconductor device and method for manufacturing the semiconductor device

Plastic molded type semiconductor device

Resin-molded semiconductor device having posts with bumps

Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby

Resin-sealed semiconductor device and method of manufacturing the device

Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support

Semiconductor device and method of fabricating the same

Semiconductor device

Semiconductor device and manufacturing method thereof

Structure of resin molded type semiconductor device with embedded thermal dissipator

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Resin-sealed type semiconductor device, and method of manufacturing the same

Semiconductor device packaged in plastic package

Method of fabricating resin-encapsulated semiconductor device

Semiconductor device including semiconductor element mounted on another semiconductor element

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

Semiconductor device and manufacturing method thereof

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

Resin-sealed semiconductor device and method of manufacturing the device

Semiconductor device which is crack resistant

Semiconductor IC device having chip support element and electrodes on the same surface

OKI SEMICONDUCTOR CO LTD

Method for fabricating resin-molded semiconductor device having posts with bumps

Method of making semiconductor device packaged by sealing resin member

Semiconductor device including semiconductor elements mounted on base plate

Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device

Semiconductor device including semiconductor elements mounted on base plate

OHUCHI SHINJI

Semiconductor device including semiconductor elements mounted on base plate