Inventor
LINDE HAROLD G
US32 patents
⚠️ This page may combine multiple inventors who share the name “LINDE HAROLD G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
30 patentsUS6627477B1Sep 30, 2003
Method of assembling a plurality of semiconductor devices having different thickness
IBM68 citations96
US6368881B1Apr 9, 2002
Wafer thickness control during backside grind
IBM54 citations96
US5431777AJul 11, 1995
Methods and compositions for the selective etching of silicon
IBM110 citations96
US5194928AMar 16, 1993
Passivation of metal in metal/polyimide structure
IBM99 citations96
US5043789AAug 27, 1991
Planarizing silsesquioxane copolymer coating
IBM54 citations96
US5896870AApr 27, 1999
Method of removing slurry particles
IBM55 citations95
US5441797AAug 15, 1995
Antireflective polyimide dielectric for photolithography
IBM36 citations95
US5397684AMar 14, 1995
Antireflective polyimide dielectric for photolithography
IBM38 citations95
US5947053ASep 7, 1999
Wear-through detector for multilayered parts and methods of using same
IBM91 citations94
US6887126B2May 3, 2005
Wafer thickness control during backside grind
IBM25 citations92
US5998569ADec 7, 1999
Environmentally stable optical filter materials
IBM31 citations92
US5114754AMay 19, 1992
Passivation of metal in metal/polyimide structures
IBM30 citations92
US4430153AFeb 7, 1984
Method of forming an RIE etch barrier by in situ conversion of a silicon containing alkyl polyamide/polyimide
IBM62 citations92
US6171436B1Jan 9, 2001
Apparatus for removing slurry particles
IBM16 citations91
US4729797AMar 8, 1988
Process for removal of cured epoxy
IBM60 citations91
US4978594ADec 18, 1990
Fluorine-containing base layer for multi-layer resist processes
IBM39 citations90
US4941941AJul 17, 1990
Method of anisotropically etching silicon wafers and wafer etching solution
IBM38 citations90
US4968552ANov 6, 1990
Versatile reactive ion etch barriers from polyamic acid salts
IBM21 citations82
US5565060AOct 15, 1996
Methods and compositions for the selective etching of silicon
IBM17 citations81
US5536792AJul 16, 1996
Antireflective polymide dielectric for photolithography
IBM12 citations81
US5503961AApr 2, 1996
Process for forming multilayer lift-off structures
IBM15 citations81
US6319884B2Nov 20, 2001
Method for removal of cured polyimide and other polymers
IBM16 citations78
US4590258AMay 20, 1986
Polyamic acid copolymer system for improved semiconductor manufacturing
IBM22 citations78
US6963132B2Nov 8, 2005
Integrated semiconductor device having co-planar device surfaces
IBM8 citations74
US5539080AJul 23, 1996
Polyimide and a semiconductor prepared therefrom
IBM6 citations73
US5451655ASep 19, 1995
Process for making thermostable coating materials
IBM7 citations73
US5153307AOct 6, 1992
Stabilization of polyamide alkyl ester solutions
IBM8 citations70
US6270949B1Aug 7, 2001
Single component developer for copolymer resists
IBM4 citations59
US7134933B2Nov 14, 2006
Wafer thickness control during backside grind
IBM0 citations52
US6426177B2Jul 30, 2002
Single component developer for use with ghost exposure
IBM0 citations45