Inventor
HUYNH CUC KIM
US8 patents
Patents
8 patentsUS6190237B1Feb 20, 2001
pH-buffered slurry and use thereof for polishing
IBM107 citations93
US5704987AJan 6, 1998
Process for removing residue from a semiconductor wafer after chemical-mechanical polishing
IBM104 citations93
US6352596B2Mar 5, 2002
Post CMP cleaning method using a brush cleaner with torque monitor
IBM27 citations89
US6287178B1Sep 11, 2001
Wafer carrier rinsing mechanism
IBM22 citations89
US6269510B1Aug 7, 2001
Post CMP clean brush with torque monitor
IBM31 citations89
US6179693B1Jan 30, 2001
In-situ/self-propelled polishing pad conditioner and cleaner
IBM44 citations89
US6135865AOct 24, 2000
CMP apparatus with built-in slurry distribution and removal
IBM27 citations89
US6299515B1Oct 9, 2001
CMP apparatus with built-in slurry distribution and removal
IBM10 citations70