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Inventor
CROUTHAMEL DAVID L
US
2 patents
Patents
2 patents
US7982307B2
Jul 19, 2011
Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
AGERE SYSTEMS INC
9 citations
79
US7479695B2
Jan 20, 2009
Low thermal resistance assembly for flip chip applications
AGERE SYSTEMS INC
3 citations
57