Inventor

SMEYS PETER

US77 patents

⚠️ This page may combine multiple inventors who share the name “SMEYS PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SMEYS PETER

NAT SEMICONDUCTOR CORP

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuits with inductors

Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits

Method of forming a MEMS topped integrated circuit with a stress relief layer

MEMS power inductor

On-chip inductor for high current applications

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

MEMS-topped integrated circuit with a stress relief layer

Method of fabricating an inductor structure on an integrated circuit structure

Methods of forming inductors on integrated circuits

Method of forming high capacitance semiconductor capacitors with a single lithography step

TEXAS INSTRUMENTS INC

Laterally vibrating bulk acoustic wave resonator

Using acoustic reflector to reduce spurious modes

Through wafer trench isolation between transistors in an integrated circuit

Highly dispersive bulk acoustic wave resonators

Semiconductor devices and methods and apparatus to produce such semiconductor devices

Piezoelectric resonator with patterned resonant confiners

Through wafer trench isolation between transistors in an integrated circuit

Thermal and stress isolation for precision circuit

Methods and apparatus to measure resonant sensors based on detection of group delay

INVENSENSE INC

Integrated CMOS and MEMS sensor fabrication method and structure

CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture

CMOS-MEMS integration using metal silicide formation

CMOS-MEMS-CMOS platform

CMOS-MEMS integration by sequential bonding method

CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture

MEMS-CMOS device that minimizes outgassing and methods of manufacture

3D integration using Al—Ge eutectic bond interconnect

SMEYS PETER

Method and system for forming a capacitive micromachined ultrasonic transducer

Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors

Methods for fabricating deep trench capacitors

Inductive structure and method of forming the inductive structure with an attached core structure

Integrated circuit micro-module

IBM

SOI CMOS dynamic circuits having threshold voltage control

Pair of FETs including a shared SOI body contact and the method of forming the FETs

Fuse structure with thermal and crack-stop protection

Anti-spacer structure for self-aligned independent gate implantation

Pair of FETs including a shared SOI body contact and the method of forming the FETs

MOHAN ANURAAG

Integrated circuit micro-module

Integrated circuit micro-module

INFINEON TECHNOLOGIES CORP

Electrical fuses employing reverse biasing to enhance programming

RATNAKUMAR ALBERT

Integrated circuit resistors with reduced parasitic capacitance

LEE DOK WON

High frequency semiconductor transformer

RATAKONDA DEEPA

Metal-insulator-metal capacitors between metal interconnect layers

ALTERA CORP

Variable gate width FinFET

SUN MICROSYSTEMS INC

System and method for detecting and preventing race condition in circuits