Inventor
SKROVAN JOHN
US17 patents
Patents
17 patentsUS6203413B1Mar 20, 2001
Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC189 citations99
US5645682AJul 8, 1997
Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC209 citations99
US6060395AMay 9, 2000
Planarization method using a slurry including a dispersant
MICRON TECHNOLOGY INC98 citations98
US6361413B1Mar 26, 2002
Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assemblies
MICRON TECHNOLOGY INC56 citations96
US6136218AOct 24, 2000
Planarization fluid composition including chelating agents
MICRON TECHNOLOGY INC48 citations96
US6048405AApr 11, 2000
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC43 citations96
US6006765ADec 28, 1999
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC47 citations96
US5916819AJun 29, 1999
Planarization fluid composition chelating agents and planarization method using same
MICRON TECHNOLOGY INC87 citations96
US5849091ADec 15, 1998
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC78 citations96
US5846336ADec 8, 1998
Apparatus and method for conditioning a planarizing substrate used in mechanical and chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC90 citations96
US5827781AOct 27, 1998
Planarization slurry including a dispersant and method of using same
MICRON TECHNOLOGY INC82 citations96
US6110830AAug 29, 2000
Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing methods of forming aluminum-comprising lines
MICRON TECHNOLOGY INC33 citations92
US6391779B1May 21, 2002
Planarization process
MICRON TECHNOLOGY INC16 citations84
US6280924B1Aug 28, 2001
Planarization method using fluid composition including chelating agents
MICRON TECHNOLOGY INC5 citations74
US6277746B1Aug 21, 2001
Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing, and semicoductor processing methods of forming aluminum-comprising lines
MICRON TECHNOLOGY INC6 citations74
US6509272B2Jan 21, 2003
Planarization method using fluid composition including chelating agents
MICRON TECHNOLOGY INC1 citations63
US6739955B2May 25, 2004
Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC0 citations52