Inventor
LE COZ CHRISTIAN ROBERT
US11 patents
Patents
11 patentsUS6759738B1Jul 6, 2004
Systems interconnected by bumps of joining material
IBM133 citations98
US5872051AFeb 16, 1999
Process for transferring material to semiconductor chip conductive pads using a transfer substrate
IBM189 citations98
US6437254B1Aug 20, 2002
Apparatus and method for printed circuit board repair
IBM46 citations95
US5809641ASep 22, 1998
Method for printed circuit board repair
IBM28 citations91
US5941449AAug 24, 1999
Method of making an electronic package having spacer elements
IBM25 citations88
US5762258AJun 9, 1998
Method of making an electronic package having spacer elements
IBM27 citations88
US5735450AApr 7, 1998
Apparatus and method for heating a board-mounted electrical module for rework
IBM37 citations88
US6574780B2Jun 3, 2003
Method and system for electronically modeling and estimating characteristics of a multi-layer integrated circuit chip carrier
IBM18 citations83
US6115912ASep 12, 2000
Apparatus and method for printed circuit board repair
IBM11 citations81
US6295724B1Oct 2, 2001
Apparatus for printed circuit board repair
IBM6 citations72
US6018866AFeb 1, 2000
Apparatus and method for printed circuit board repair
IBM4 citations72