Inventor
PIERSON MARK VINCENT
US36 patents
⚠️ This page may combine multiple inventors who share the name “PIERSON MARK VINCENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
35 patentsUS6165885ADec 26, 2000
Method of making components with solder balls
IBM265 citations99
US6759738B1Jul 6, 2004
Systems interconnected by bumps of joining material
IBM133 citations98
US5872051AFeb 16, 1999
Process for transferring material to semiconductor chip conductive pads using a transfer substrate
IBM189 citations98
US6399892B1Jun 4, 2002
CTE compensated chip interposer
IBM91 citations97
US5818107AOct 6, 1998
Chip stacking by edge metallization
IBM133 citations97
US6664637B2Dec 16, 2003
Flip chip C4 extension structure and process
IBM63 citations95
US6437254B1Aug 20, 2002
Apparatus and method for printed circuit board repair
IBM46 citations95
US6225206B1May 1, 2001
Flip chip C4 extension structure and process
IBM67 citations95
US6150726ANov 21, 2000
Component carrier with raised bonding sites
IBM51 citations95
US5759737AJun 2, 1998
Method of making a component carrier
IBM62 citations95
US6252779B1Jun 26, 2001
Ball grid array via structure
IBM33 citations93
US6516513B2Feb 11, 2003
Method of making a CTE compensated chip interposer
IBM41 citations92
US6156165ADec 5, 2000
Method of forming a metallization feature on an edge of an IC chip
IBM20 citations92
US5938106AAug 17, 1999
Method and apparatus for applying solder and forming solder balls on a substrate
IBM22 citations92
US5903437AMay 11, 1999
High density edge mounting of chips
IBM24 citations92
US5796452AAug 18, 1998
Simplified wiring escape technique for tiled display
IBM47 citations92
US5809641ASep 22, 1998
Method for printed circuit board repair
IBM28 citations91
US6774315B1Aug 10, 2004
Floating interposer
IBM43 citations90
US5875011AFeb 23, 1999
Liquid crystal display tile interconnected to a tile carrier and method
IBM24 citations89
US5818697AOct 6, 1998
Flexible thin film ball grid array containing solder mask
IBM22 citations88
US5672980ASep 30, 1997
Method and apparatus for testing integrated circuit chips
IBM26 citations87
US5808710ASep 15, 1998
Liquid crystal display tile interconnect structure
IBM18 citations84
US6115912ASep 12, 2000
Apparatus and method for printed circuit board repair
IBM11 citations81
US6708871B2Mar 23, 2004
Method for forming solder connections on a circuitized substrate
IBM8 citations74
US6492724B2Dec 10, 2002
Structure for reinforcing a semiconductor device to prevent cracking
IBM8 citations73
US6197619B1Mar 6, 2001
Method for reinforcing a semiconductor device to prevent cracking
IBM10 citations73
US6059939AMay 9, 2000
Method for high density edge mounting of chips
IBM8 citations73
US6295724B1Oct 2, 2001
Apparatus for printed circuit board repair
IBM6 citations72
US6255208B1Jul 3, 2001
Selective wafer-level testing and burn-in
IBM10 citations72
US6018866AFeb 1, 2000
Apparatus and method for printed circuit board repair
IBM4 citations72
US5777705AJul 7, 1998
Wire bond attachment of a liquid crystal display tile to a tile carrier
IBM15 citations71
US6187610B1Feb 13, 2001
Flexible thin film ball grid array containing solder mask
IBM10 citations69
US5659256AAug 19, 1997
Method and apparatus for testing integrated circuit chips
IBM8 citations68
US6946329B2Sep 20, 2005
Methods of making and using a floating interposer
IBM4 citations60
US6027006AFeb 22, 2000
Method and apparatus for applying solder and forming solder balls on a substrate
IBM1 citations52