Inventor
SARKHEL AMIT KUMAR
US12 patents
Patents
12 patentsUS5874043AFeb 23, 1999
Lead-free, high tin ternary solder alloy of tin, silver, and indium
IBM47 citations96
US5729440AMar 17, 1998
Solder hierarchy for chip attachment to substrates
IBM100 citations96
US6437254B1Aug 20, 2002
Apparatus and method for printed circuit board repair
IBM46 citations95
US6010060AJan 4, 2000
Lead-free solder process
IBM35 citations92
US5809641ASep 22, 1998
Method for printed circuit board repair
IBM28 citations91
US6545229B1Apr 8, 2003
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM20 citations90
US5742483AApr 21, 1998
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM17 citations90
US6115912ASep 12, 2000
Apparatus and method for printed circuit board repair
IBM11 citations81
US6295724B1Oct 2, 2001
Apparatus for printed circuit board repair
IBM6 citations72
US6018866AFeb 1, 2000
Apparatus and method for printed circuit board repair
IBM4 citations72
US5655703AAug 12, 1997
Solder hierarchy for chip attachment to substrates
IBM14 citations72
US6167615B1Jan 2, 2001
Method for producing circuit board assemblies using surface mount components with finely spaced leads
IBM7 citations71