Inventor
FANTI LISA A
US12 patents
⚠️ This page may combine multiple inventors who share the name “FANTI LISA A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6015505AJan 18, 2000
Process improvements for titanium-tungsten etching in the presence of electroplated C4's
IBM88 citations97
US6258627B1Jul 10, 2001
Underfill preform interposer for joining chip to substrate
IBM69 citations96
US6622907B2Sep 23, 2003
Sacrificial seed layer process for forming C4 solder bumps
IBM78 citations95
US5935402AAug 10, 1999
Process for stabilizing organic additives in electroplating of copper
IBM58 citations95
US6130170AOct 10, 2000
Process improvements for titanium-tungsten etching in the presence of electroplated C4's
IBM36 citations92
US5908540AJun 1, 1999
Copper anode assembly for stabilizing organic additives in electroplating of copper
IBM22 citations92
US5904156AMay 18, 1999
Dry film resist removal in the presence of electroplated C4's
IBM74 citations90
US6468413B1Oct 22, 2002
Electrochemical etch for high tin solder bumps
IBM19 citations88
US6995475B2Feb 7, 2006
I/C chip suitable for wire bonding
IBM9 citations73
US7572726B2Aug 11, 2009
Method of forming a bond pad on an I/C chip and resulting structure
IBM0 citations51
US6900142B2May 31, 2005
Inhibition of tin oxide formation in lead free interconnect formation
IBM1 citations46