Inventor
AMAGAI MASAZUMI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “AMAGAI MASAZUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
18 patentsUS6144102ANov 7, 2000
Semiconductor device package
TEXAS INSTRUMENTS INC99 citations98
US6118183ASep 12, 2000
Semiconductor device, manufacturing method thereof, and insulating substrate for same
TEXAS INSTRUMENTS INC55 citations96
US5960260ASep 28, 1999
Semiconductor device, its manufacturing method, and dicing adhesive element therefor
TEXAS INSTRUMENTS INC74 citations96
US7520052B2Apr 21, 2009
Method of manufacturing a semiconductor device
TEXAS INSTRUMENTS INC33 citations92
US6873059B2Mar 29, 2005
Semiconductor package with metal foil attachment film
TEXAS INSTRUMENTS INC25 citations92
US6762506B2Jul 13, 2004
Assembly of semiconductor device and wiring substrate
TEXAS INSTRUMENTS INC20 citations92
US6602803B2Aug 5, 2003
Direct attachment semiconductor chip to organic substrate
TEXAS INSTRUMENTS INC27 citations92
US5986335ANov 16, 1999
Semiconductor device having a tapeless mounting
TEXAS INSTRUMENTS INC41 citations92
US6232661B1May 15, 2001
Semiconductor device in BGA package and manufacturing method thereof
TEXAS INSTRUMENTS INC47 citations89
US7626274B2Dec 1, 2009
Semiconductor device with an improved solder joint
TEXAS INSTRUMENTS INC10 citations84
US7971351B2Jul 5, 2011
Method of manufacturing a semiconductor device
TEXAS INSTRUMENTS INC6 citations74
US7042070B2May 9, 2006
Direct attachment of semiconductor chip to organic substrate
TEXAS INSTRUMENTS INC8 citations74
US6784022B2Aug 31, 2004
Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits
TEXAS INSTRUMENTS INC12 citations73
US6713851B1Mar 30, 2004
Lead over chip semiconductor device including a heat sink for heat dissipation
TEXAS INSTRUMENTS INC12 citations73
US7786599B2Aug 31, 2010
Semiconductor device with an improved solder joint
TEXAS INSTRUMENTS INC4 citations63
US7701071B2Apr 20, 2010
Method for fabricating flip-attached and underfilled semiconductor devices
TEXAS INSTRUMENTS INC3 citations62
US7884009B2Feb 8, 2011
Semiconductor device with an improved solder joint
TEXAS INSTRUMENTS INC0 citations52
US7679002B2Mar 16, 2010
Semiconductive device having improved copper density for package-on-package applications
TEXAS INSTRUMENTS INC0 citations52
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10580728B2Mar 3, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations73
US11810848B2Nov 7, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11094623B2Aug 17, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394703B2Aug 19, 2025
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52