Inventor
EBE KAZUYOSHI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “EBE KAZUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
23 patentsUS5110388AMay 5, 1992
Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape
LINTEC CORP150 citations98
US6398892B1Jun 4, 2002
Method of using pressure sensitive adhesive double coated sheet
LINTEC CORP91 citations97
US6465330B1Oct 15, 2002
Method for grinding a wafer back
LINTEC CORP64 citations96
US5976691ANov 2, 1999
Process for producing chip and pressure sensitive adhesive sheet for said process
LINTEC CORP42 citations95
US5356949AOct 18, 1994
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
LINTEC CORP75 citations95
US5187007AFeb 16, 1993
Adhesive sheets
LINTEC CORP80 citations95
US5118567AJun 2, 1992
Adhesive tape and use thereof
LINTEC CORP100 citations95
US6977024B2Dec 20, 2005
Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
LINTEC CORP23 citations93
US6753614B2Jun 22, 2004
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, and semiconductor chip packaging body
LINTEC CORP23 citations93
US6718223B1Apr 6, 2004
Method of processing semiconductor wafer and semiconductor wafer supporting member
LINTEC CORP22 citations92
US6702910B2Mar 9, 2004
Process for producing a chip
LINTEC CORP36 citations92
US6436795B2Aug 20, 2002
Process for producing semiconductor chip
LINTEC CORP20 citations92
US6312800B1Nov 6, 2001
Pressure sensitive adhesive sheet for producing a chip
LINTEC CORP24 citations92
US6297076B1Oct 2, 2001
Process for preparing a semiconductor wafer
LINTEC CORP25 citations92
US6171672B1Jan 9, 2001
Cover tape for chip transportation and sealed structure
LINTEC CORP20 citations92
US6225194B1May 1, 2001
Process for producing chip and pressure sensitive adhesive sheet for said process
LINTEC CORP40 citations91
US6156423ADec 5, 2000
Base material and adhesive tape using the same
LINTEC CORP19 citations91
US6139953AOct 31, 2000
Adhesive tape, base material for adhesive tape and their manufacturing methods
LINTEC CORP34 citations89
US6911720B2Jun 28, 2005
Semiconductor device adhesive sheet with conductor bodies buried therein
LINTEC CORP8 citations74
US6900550B2May 31, 2005
Semiconductor device including adhesive agent layer with embedded conductor bodies
LINTEC CORP7 citations74
US6855418B2Feb 15, 2005
Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same
LINTEC CORP8 citations74
US4994300AFeb 19, 1991
Method of making a cover tape for sealing chip-holding parts of carrier tape
LINTEC CORP8 citations72
US6723619B2Apr 20, 2004
Pressure sensitive adhesive sheet for semiconductor wafer processing
LINTEC CORP6 citations62