Inventor · disambiguated record

Hwa Seob Lee

Also filed as: LEE HWA SEOB

1 granted patent·12 citations·filing 2007–2007

34Inventor score

Technology areasH10W

Files withHYNIX SEMICONDUCTOR INC1

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1 record

0172US7896051B2Semiconductor die bonding apparatus having multiple bonding head unitsHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Mar 1, 2011·12 cites·16 claims

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