Inventor

MIYATAKE MASATO

JP24 patents

⚠️ This page may combine multiple inventors who share the name “MIYATAKE MASATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIYATAKE MASATO

HITACHI CHEMICAL CO LTD

Prepreg, metal-clad laminate, and printed circuit board obtained from these

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Aerogel

Sol composition, aerogel composite, support member provided with aerogel composite, and heat insulator

Sugar alcohol microcapsule, slurry, and resin molded article

Hybrid optical/electrical mixed circuit board

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

Aerogel composite powder

Sol composition

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board

Production method for aerogel laminate, and aerogel laminate roll

Aerogel laminated composite and thermal insulation material

Aerogel

Aerogel

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Aerogel laminate and thermal insulation material

Production method for aerogel laminate, and aerogel laminate roll

Sugar alcohol microcapsule, slurry, and resin molded article

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

KOTAKE TOMOHIKO

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Prepreg, laminate obtained with the same and printed-wiring board

NAGAI SHUNSUKE

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

MIYATAKE MASATO

Resin composition, prepreg laminate obtained with the same and printed-wiring board