Inventor
LEE DAWN M
US16 patents
⚠️ This page may combine multiple inventors who share the name “LEE DAWN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
14 patentsUS6168508B1Jan 2, 2001
Polishing pad surface for improved process control
LSI LOGIC CORP92 citations97
US5931719AAug 3, 1999
Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
LSI LOGIC CORP131 citations97
US6179956B1Jan 30, 2001
Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
LSI LOGIC CORP57 citations96
US5816900AOct 6, 1998
Apparatus for polishing a substrate at radially varying polish rates
LSI LOGIC CORP98 citations95
US6004193ADec 21, 1999
Dual purpose retaining ring and polishing pad conditioner
LSI LOGIC CORP70 citations94
US6531397B1Mar 11, 2003
Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
LSI LOGIC CORP17 citations92
US6391768B1May 21, 2002
Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure
LSI LOGIC CORP28 citations92
US6074288AJun 13, 2000
Modified carrier films to produce more uniformly polished substrate surfaces
LSI LOGIC CORP24 citations92
US5961375AOct 5, 1999
Shimming substrate holder assemblies to produce more uniformly polished substrate surfaces
LSI LOGIC CORP30 citations92
US5941761AAug 24, 1999
Shaping polishing pad to control material removal rate selectively
LSI LOGIC CORP37 citations92
US6066266AMay 23, 2000
In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation
LSI LOGIC CORP32 citations90
US6607967B1Aug 19, 2003
Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrate
LSI LOGIC CORP19 citations84
US6106371AAug 22, 2000
Effective pad conditioning
LSI LOGIC CORP18 citations84
US5944585AAug 31, 1999
Use of abrasive tape conveying assemblies for conditioning polishing pads
LSI LOGIC CORP18 citations84