P

Inventor

PRAMANICK SHEKHAR

US61 patents
⚠️ This page may combine multiple inventors who share the name “PRAMANICK SHEKHAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

49 patents
US6670260B1Dec 30, 2003

Transistor with local insulator structure

ADVANCED MICRO DEVICES INC124 citations99
US6380019B1Apr 30, 2002

Method of manufacturing a transistor with local insulator structure

ADVANCED MICRO DEVICES INC150 citations99
US6344410B1Feb 5, 2002

Manufacturing method for semiconductor metalization barrier

ADVANCED MICRO DEVICES INC292 citations99
US6221724B1Apr 24, 2001

Method of fabricating an integrated circuit having punch-through suppression

ADVANCED MICRO DEVICES INC156 citations99
US6144099ANov 7, 2000

Semiconductor metalization barrier

ADVANCED MICRO DEVICES INC319 citations99
US5617991AApr 8, 1997

Method for electrically conductive metal-to-metal bonding

ADVANCED MICRO DEVICES INC271 citations99
US6303505B1Oct 16, 2001

Copper interconnect with improved electromigration resistance

ADVANCED MICRO DEVICES INC87 citations98
US6184112B1Feb 6, 2001

Method of forming a MOSFET transistor with a shallow abrupt retrograde dopant profile

ADVANCED MICRO DEVICES INC136 citations98
US6147000ANov 14, 2000

Method for forming low dielectric passivation of copper interconnects

ADVANCED MICRO DEVICES INC138 citations98
US6022808AFeb 8, 2000

Copper interconnect methodology for enhanced electromigration resistance

ADVANCED MICRO DEVICES INC105 citations98
US6734559B1May 11, 2004

Self-aligned semiconductor interconnect barrier and manufacturing method therefor

ADVANCED MICRO DEVICES INC59 citations96
US6660634B1Dec 9, 2003

Method of forming reliable capped copper interconnects

ADVANCED MICRO DEVICES INC67 citations96
US6492266B1Dec 10, 2002

Method of forming reliable capped copper interconnects

ADVANCED MICRO DEVICES INC53 citations96
US6239021B1May 29, 2001

Dual barrier and conductor deposition in a dual damascene process for semiconductors

ADVANCED MICRO DEVICES INC52 citations96
US6214731B1Apr 10, 2001

Copper metalization with improved electromigration resistance

ADVANCED MICRO DEVICES INC75 citations96
US6211084B1Apr 3, 2001

Method of forming reliable copper interconnects

ADVANCED MICRO DEVICES INC55 citations96
US6180469B1Jan 30, 2001

Low resistance salicide technology with reduced silicon consumption

ADVANCED MICRO DEVICES INC69 citations96
US6165894ADec 26, 2000

Method of reliably capping copper interconnects

ADVANCED MICRO DEVICES INC64 citations96
US6054398AApr 25, 2000

Semiconductor interconnect barrier for fluorinated dielectrics

ADVANCED MICRO DEVICES INC59 citations96
US5937315AAug 10, 1999

Self-aligned silicide gate technology for advanced submicron MOS devices

ADVANCED MICRO DEVICES INC51 citations96
US6465345B1Oct 15, 2002

Prevention of inter-channel current leakage in semiconductors

ADVANCED MICRO DEVICES INC22 citations93
US6369429B1Apr 9, 2002

Low resistance composite contact structure utilizing a reaction barrier layer under a metal layer

ADVANCED MICRO DEVICES INC31 citations93
US6362063B1Mar 26, 2002

Formation of low thermal budget shallow abrupt junctions for semiconductor devices

ADVANCED MICRO DEVICES INC41 citations93
US6362526B1Mar 26, 2002

Alloy barrier layers for semiconductors

ADVANCED MICRO DEVICES INC33 citations93
US6361837B2Mar 26, 2002

Method and system for modifying and densifying a porous film

ADVANCED MICRO DEVICES INC19 citations93
US6350678B1Feb 26, 2002

Chemical-mechanical polishing of semiconductors

ADVANCED MICRO DEVICES INC38 citations93
US6171949B1Jan 9, 2001

Low energy passivation of conductive material in damascene process for semiconductors

ADVANCED MICRO DEVICES INC22 citations93
US6172421B1Jan 9, 2001

Semiconductor device having an intermetallic layer on metal interconnects

ADVANCED MICRO DEVICES INC29 citations93
US6165902ADec 26, 2000

Low resistance metal contact technology

ADVANCED MICRO DEVICES INC18 citations93
US6117770ASep 12, 2000

Method for implanting semiconductor conductive layers

ADVANCED MICRO DEVICES INC52 citations93
US6084271AJul 4, 2000

Transistor with local insulator structure

ADVANCED MICRO DEVICES INC31 citations93
US6015752AJan 18, 2000

Elevated salicide technology

ADVANCED MICRO DEVICES INC40 citations93
US5994191ANov 30, 1999

Elevated source/drain salicide CMOS technology

ADVANCED MICRO DEVICES INC39 citations93
US6596598B1Jul 22, 2003

T-shaped gate device and method for making

ADVANCED MICRO DEVICES INC31 citations92
US6169039B1Jan 2, 2001

Electron bean curing of low-k dielectrics in integrated circuits

ADVANCED MICRO DEVICES INC41 citations92
US6147404ANov 14, 2000

Dual barrier and conductor deposition in a dual damascene process for semiconductors

ADVANCED MICRO DEVICES INC29 citations92
US6143650ANov 7, 2000

Semiconductor interconnect interface processing by pulse laser anneal

ADVANCED MICRO DEVICES INC42 citations92
US6127193AOct 3, 2000

Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure

ADVANCED MICRO DEVICES INC41 citations92
US6117769ASep 12, 2000

Pad structure for copper interconnection and its formation

ADVANCED MICRO DEVICES INC24 citations92
US6087209AJul 11, 2000

Formation of low resistance, ultra shallow LDD junctions employing a sub-surface, non-amorphous implant

ADVANCED MICRO DEVICES INC32 citations92
US6074937AJun 13, 2000

End-of-range damage suppression for ultra-shallow junction formation

ADVANCED MICRO DEVICES INC37 citations92
US6008098ADec 28, 1999

Ultra shallow junction formation using amorphous silicon layer

ADVANCED MICRO DEVICES INC36 citations92
US5876903AMar 2, 1999

Virtual hard mask for etching

ADVANCED MICRO DEVICES INC43 citations92
US5789310AAug 4, 1998

Method of forming shallow junctions by entrapment of interstitial atoms

ADVANCED MICRO DEVICES INC25 citations92
US5504017AApr 2, 1996

Void detection in metallization patterns

ADVANCED MICRO DEVICES INC25 citations92
US6380625B2Apr 30, 2002

Semiconductor interconnect barrier and manufacturing method thereof

ADVANCED MICRO DEVICES INC19 citations84
US6046106AApr 4, 2000

High density plasma oxide gap filled patterned metal layers with improved electromigration resistance

ADVANCED MICRO DEVICES INC18 citations84
US6372563B1Apr 16, 2002

Self-aligned SOI device with body contact and NiSi2 gate

ADVANCED MICRO DEVICES INC13 citations74
US6344691B1Feb 5, 2002

Barrier materials for metal interconnect in a semiconductor device

ADVANCED MICRO DEVICES INC6 citations74

(unassigned)

1 patent

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