Inventor

VASQUEZ BARBARA

DE42 patents

⚠️ This page may combine multiple inventors who share the name “VASQUEZ BARBARA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VASQUEZ BARBARA

INFINEON TECHNOLOGIES AG

Transfer wafer level packaging

Method for connection of circuit units

Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

Semiconductor circuit module and method for fabricating semiconductor circuit modules

Method of producing a semiconductor component having a compliant buffer layer

Semiconductor chip, memory module and method for testing the semiconductor chip

Method of making pad-rerouting for integrated circuit chips

Forming a structure on a wafer

Method of applying a bottom surface protective coating to a wafer, and wafer dicing method

Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Process for producing a semiconductor chip

Connection of integrated circuit to a substrate

Compliant relief wafer level packaging

Self-adhering chip

Fuse programmable I/O organization

Method for producing a semiconductor device and corresponding semiconductor device

Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit

Electronic structure

Method for producing an electronic component, especially a memory chip

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Method producing a contact connection between a semiconductor chip and a substrate and the contact connection

Process for producing a component module

MOTOROLA INC

Encapsulation method for localized oxidation of silicon with trench isolation

Method for forming a field emission device

Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

Semiconductor wafer contact system and method for contacting a semiconductor wafer

Semiconductor wafer contact system and method for contacting a semiconductor wafer

High-pressure polysilicon encapsulated localized oxidation of silicon

Vertical MOSFET device having frontside and backside contacts

Method for aligning a semiconductor device

Method of fabricating a structure having self-aligned diffused junctions

Multiple trench semiconductor structure method

Integrated circuit testing board having constrained thermal expansion characteristics

Method of forming planar isolation regions

Method of fabricating semiconductor devices having deep and shallow isolation structures

Method for planarizing isolated regions

Fabrication of devices having laterally isolated semiconductor regions

Polysilicon encapsulated localized oxidation of silicon

Non-homogeneous multi-elemental electron emitter

FORMFACTOR INC

Mechanically reconfigurable vertical tester interface for IC probing

Mechanically reconfigurable vertical tester interface for IC probing

KHANDROS IGOR Y

Stacked die module