Inventor

GOTKIS YEHIEL

US63 patents

⚠️ This page may combine multiple inventors who share the name “GOTKIS YEHIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOTKIS YEHIEL

LAM RES CORP

Wafer cleaning module and method for cleaning the surface of a substrate

System and method for controlled polishing and planarization of semiconductor wafers

Method and apparatus for thin metal film thickness measurement

Method and apparatus for slurry distribution

Edge instability suppressing device and system

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Semiconductor structure implementing low-K dielectric materials and supporting stubs

Multiple-conditioning member device for chemical mechanical planarization conditioning

System and method for metal residue detection and mapping within a multi-step sequence

Method and apparatus of arrayed sensors for metrological control

System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques

Polishing pad ironing system and method for implementing the same

Wafer carrier with groove for decoupling retainer ring from water

End-point detection system for chemical mechanical posing applications

Integration of sensor based metrology into semiconductor processing tools

Methods for fabricating interconnect structures having Low K dielectric properties

Method and apparatus for real time metal film thickness measurement

System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques

Infrared end-point detection system

Subaperture chemical mechanical polishing system

Integrated planarization and clean wafer processing system

System and method for in-situ measuring and monitoring CMP polishing pad thickness

Semiconductor structure implementing sacrificial material and methods for making and implementing the same

Enhancement of eddy current based measurement capabilities

End-point detection apparatus

Chemical mechanical planarization system with replaceable pad assembly

Method and apparatus of arrayed sensors for metrological control

Activated slurry CMP system and methods for implementing the same

Apparatus for removal/remaining thickness profile manipulation

System, method and apparatus for thin-film substrate signal separation using eddy current

End-point detection system for chemical mechanical polishing applications

Activated slurry CMP system and methods for implementing the same

Wafer cleaning module and method for cleaning the surface of a substrate

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Active retaining ring support

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

Method and apparatus for chemical mechanical planarization

CMP belt stretch compensation apparatus and methods for using the same

Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties

Profiled retaining ring for chemical mechanical planarization

Method for making semiconductor structures implementing sacrificial material

Apparatus for reducing compressed dry air usage during chemical mechanical planarization

KLA TENCOR TECH CORP

Temperature stabilization for substrate processing

Dynamic pattern generator with cup-shaped structure

Tungsten plug deposition quality evaluation method by EBACE technology

KLA TENCOR CORP

Inline inspection of photovoltaics for electrical defects

Pillar-supported array of micro electron lenses

SPEEDFAM IPEC

Multi-step chemical mechanical polishing

GOTKIS YEHIEL

Methods and apparatus for thin metal film thickness measurement