Inventor
FOSTER ELIZABETH
US28 patents
⚠️ This page may combine multiple inventors who share the name “FOSTER ELIZABETH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS6373717B1Apr 16, 2002
Electronic package with high density interconnect layer
IBM97 citations97
US5374454ADec 20, 1994
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM71 citations96
US5730890AMar 24, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM35 citations95
US5591285AJan 7, 1997
Fluorinated carbon polymer composites
IBM38 citations95
US5397863AMar 14, 1995
Fluorinated carbon polymer composites
IBM35 citations95
US6829823B2Dec 14, 2004
Method of making a multi-layered interconnect structure
IBM31 citations92
US6706464B2Mar 16, 2004
Method of fabricating circuitized structures
IBM15 citations92
US5863332AJan 26, 1999
Fluid jet impregnating and coating device with thickness control capability
IBM26 citations92
US5800858ASep 1, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM20 citations92
US5571852ANov 5, 1996
Fluorinated carbon polymer composites
IBM20 citations92
US5556899ASep 17, 1996
Fluorinated carbon polymer composites
IBM28 citations92
US6924224B2Aug 2, 2005
Method of forming filled blind vias
IBM16 citations91
US6522014B1Feb 18, 2003
Fabrication of a metalized blind via
IBM23 citations91
US5158645AOct 27, 1992
Method of external circuitization of a circuit panel
IBM28 citations88
US5709906AJan 20, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM12 citations81
US6835533B2Dec 28, 2004
Photoimageable dielectric epoxy resin system film
IBM5 citations73
US6528218B1Mar 4, 2003
Method of fabricating circuitized structures
IBM12 citations73
US5874154AFeb 23, 1999
Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern
IBM9 citations73
US7084509B2Aug 1, 2006
Electronic package with filled blinds vias
IBM8 citations72
US6576549B2Jun 10, 2003
Fabrication of a metalized blind via
IBM5 citations72
US6207351B1Mar 27, 2001
Method for pattern seeding and plating of high density printed circuit boards
IBM11 citations72
US6843929B1Jan 18, 2005
Accelerated etching of chromium
IBM3 citations61
CA MINISTER AGRICULTURE & FOOD
3 patentsUS7303917B2Dec 4, 2007
Modification of pollen coat protein composition
CA MINISTER AGRICULTURE & FOOD2 citations57
US6784289B2Aug 31, 2004
Translational regulatory elements
CA MINISTER AGRICULTURE & FOOD2 citations54
US7303873B2Dec 4, 2007
Cryptic regulatory elements obtained from plants
CA MINISTER AGRICULTURE & FOOD0 citations45