P

Inventor

FOSTER ELIZABETH

US28 patents
⚠️ This page may combine multiple inventors who share the name “FOSTER ELIZABETH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

22 patents
US6373717B1Apr 16, 2002

Electronic package with high density interconnect layer

IBM97 citations97
US5374454ADec 20, 1994

Method for conditioning halogenated polymeric materials and structures fabricated therewith

IBM71 citations96
US5730890AMar 24, 1998

Method for conditioning halogenated polymeric materials and structures fabricated therewith

IBM35 citations95
US5591285AJan 7, 1997

Fluorinated carbon polymer composites

IBM38 citations95
US5397863AMar 14, 1995

Fluorinated carbon polymer composites

IBM35 citations95
US6829823B2Dec 14, 2004

Method of making a multi-layered interconnect structure

IBM31 citations92
US6706464B2Mar 16, 2004

Method of fabricating circuitized structures

IBM15 citations92
US5863332AJan 26, 1999

Fluid jet impregnating and coating device with thickness control capability

IBM26 citations92
US5800858ASep 1, 1998

Method for conditioning halogenated polymeric materials and structures fabricated therewith

IBM20 citations92
US5571852ANov 5, 1996

Fluorinated carbon polymer composites

IBM20 citations92
US5556899ASep 17, 1996

Fluorinated carbon polymer composites

IBM28 citations92
US6924224B2Aug 2, 2005

Method of forming filled blind vias

IBM16 citations91
US6522014B1Feb 18, 2003

Fabrication of a metalized blind via

IBM23 citations91
US5158645AOct 27, 1992

Method of external circuitization of a circuit panel

IBM28 citations88
US5709906AJan 20, 1998

Method for conditioning halogenated polymeric materials and structures fabricated therewith

IBM12 citations81
US6835533B2Dec 28, 2004

Photoimageable dielectric epoxy resin system film

IBM5 citations73
US6528218B1Mar 4, 2003

Method of fabricating circuitized structures

IBM12 citations73
US5874154AFeb 23, 1999

Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern

IBM9 citations73
US7084509B2Aug 1, 2006

Electronic package with filled blinds vias

IBM8 citations72
US6576549B2Jun 10, 2003

Fabrication of a metalized blind via

IBM5 citations72
US6207351B1Mar 27, 2001

Method for pattern seeding and plating of high density printed circuit boards

IBM11 citations72
US6843929B1Jan 18, 2005

Accelerated etching of chromium

IBM3 citations61

CA MINISTER AGRICULTURE & FOOD

3 patents

ENDICOTT INTERCONNECT TECH INC

2 patents

PHYO GABRIELLE SARAH

1 patent