Inventor
BOND ROBERT H
US22 patents
⚠️ This page may combine multiple inventors who share the name “BOND ROBERT H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SGS THOMSON MICROELECTRONICS
9 patentsUS5642261AJun 24, 1997
Ball-grid-array integrated circuit package with solder-connected thermal conductor
SGS THOMSON MICROELECTRONICS283 citations99
US5642265AJun 24, 1997
Ball grid array package with detachable module
SGS THOMSON MICROELECTRONICS44 citations96
US4915565AApr 10, 1990
Manipulation and handling of integrated circuit dice
SGS THOMSON MICROELECTRONICS99 citations94
US5724728AMar 10, 1998
Method of mounting an integrated circuit to a mounting surface
SGS THOMSON MICROELECTRONICS29 citations92
US5693572ADec 2, 1997
Ball grid array integrated circuit package with high thermal conductivity
SGS THOMSON MICROELECTRONICS44 citations92
US5111935AMay 12, 1992
Universal leadframe carrier
SGS THOMSON MICROELECTRONICS24 citations90
US4759675AJul 26, 1988
Chip selection in automatic assembly of integrated circuit
SGS THOMSON MICROELECTRONICS29 citations89
US5182851AFeb 2, 1993
Method for holding a strip of conductive lead frames
SGS THOMSON MICROELECTRONICS6 citations60
US4815595AMar 28, 1989
Uniform leadframe carrier
SGS THOMSON MICROELECTRONICS6 citations60
THOMSON COMPONENTS MOSTEK CORP
5 patentsUS4685998AAug 11, 1987
Process of forming integrated circuits with contact pads in a standard array
THOMSON COMPONENTS MOSTEK CORP260 citations94
US4627151ADec 9, 1986
Automatic assembly of integrated circuits
THOMSON COMPONENTS MOSTEK CORP76 citations94
US4722060AJan 26, 1988
Integrated-circuit leadframe adapted for a simultaneous bonding operation
THOMSON COMPONENTS MOSTEK CORP65 citations93
US4627787ADec 9, 1986
Chip selection in automatic assembly of integrated circuit
THOMSON COMPONENTS MOSTEK CORP27 citations89
US4626167ADec 2, 1986
Manipulation and handling of integrated circuit dice
THOMSON COMPONENTS MOSTEK CORP15 citations72