Inventor

INADA TEIICHI

JP27 patents

⚠️ This page may combine multiple inventors who share the name “INADA TEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INADA TEIICHI

HITACHI CHEMICAL CO LTD

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

Electronic component parts device

Multilayer wiring board for mounting semiconductor device and method of producing the same

Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive

Process for producing multilayer printed circuit board

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Adhesive, adhesive film and adhesive-backed metal foil

Resin composition and its use in production of multilayer printed circuit board

Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Resin member and sheet using same, and heat storage material and heat control sheet using same

Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same

Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer

Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device

Resin molding material

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

INADA TEIICHI

Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

TANAKA MAIKO

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

YASUDA YUUSUKE

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same