Inventor
YASUDA MASAAKI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “YASUDA MASAAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
12 patentsUS6223429B1May 1, 2001
Method of production of semiconductor device
HITACHI CHEMICAL CO LTD145 citations97
US7851131B2Dec 14, 2010
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
HITACHI CHEMICAL CO LTD13 citations92
US7061081B2Jun 13, 2006
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
HITACHI CHEMICAL CO LTD24 citations92
US7070670B2Jul 4, 2006
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
HITACHI CHEMICAL CO LTD46 citations91
US6404068B1Jun 11, 2002
Paste composition, and protective film and semiconductor device both obtained with the same
HITACHI CHEMICAL CO LTD21 citations90
US8034659B2Oct 11, 2011
Production method of semiconductor device and bonding film
HITACHI CHEMICAL CO LTD12 citations84
US5445877AAug 29, 1995
Unsaturated polyester resin composition and sheet-form molding material using the same
HITACHI CHEMICAL CO LTD7 citations74
US5408013AApr 18, 1995
Unsaturated polyester resin composition and sheet-form molding material using the same
HITACHI CHEMICAL CO LTD10 citations74
US6611064B1Aug 26, 2003
Semiconductor device and method for manufacturing the same
HITACHI CHEMICAL CO LTD8 citations73
US7692296B2Apr 6, 2010
Semiconductor device and multilayer substrate therefor
HITACHI CHEMICAL CO LTD2 citations62
US6774501B2Aug 10, 2004
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein
HITACHI CHEMICAL CO LTD6 citations61
US7560307B2Jul 14, 2009
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
HITACHI CHEMICAL CO LTD1 citations52
MITSUI PETROCHEMICAL IND
6 patentsUS6040407AMar 21, 2000
Chain polyene group-containing norbornene compound and unsaturated ethylene copolymer using the same
MITSUI PETROCHEMICAL IND21 citations92
US5837791ANov 17, 1998
Unsaturated copolymer of ethylene and process for preparing the same
MITSUI PETROCHEMICAL IND24 citations92
US5698751ADec 16, 1997
Branched polyene compounds and production thereof
MITSUI PETROCHEMICAL IND14 citations72
US5442121AAug 15, 1995
Process for producing N,N-disubstituted aminophenol
MITSUI PETROCHEMICAL IND3 citations61
US4783557ANov 8, 1988
Processes for preparing hydroxynaphthalenes
MITSUI PETROCHEMICAL IND3 citations58
US4962241AOct 9, 1990
Process for producing dihydroxynaphthalenes
MITSUI PETROCHEMICAL IND1 citations51
KAWAMORI TAKASHI
5 patentsUS8445177B2May 21, 2013
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8323873B2Dec 4, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8293453B2Oct 23, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI2 citations61
US8673539B2Mar 18, 2014
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51
US8278024B2Oct 2, 2012
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
KAWAMORI TAKASHI0 citations51