Inventor
URUNO MICHIO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “URUNO MICHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
6 patentsUS7968194B2Jun 28, 2011
Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
HITACHI CHEMICAL CO LTD19 citations92
US7968195B2Jun 28, 2011
Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
HITACHI CHEMICAL CO LTD18 citations92
US7875500B2Jan 25, 2011
Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support
HITACHI CHEMICAL CO LTD25 citations92
US7517724B2Apr 14, 2009
Dicing/die bonding sheet
HITACHI CHEMICAL CO LTD22 citations91
US7070670B2Jul 4, 2006
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
HITACHI CHEMICAL CO LTD46 citations91
US8017444B2Sep 13, 2011
Adhesive sheet, semiconductor device, and process for producing semiconductor device
HITACHI CHEMICAL CO LTD8 citations81
TANAKA MAIKO
2 patentsUS8470115B2Jun 25, 2013
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
TANAKA MAIKO8 citations81
US8465615B2Jun 18, 2013
Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
TANAKA MAIKO8 citations81