Inventor

IWAKURA TETSUROU

JP7 patents

⚠️ This page may combine multiple inventors who share the name “IWAKURA TETSUROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

5 patents

US7070670B2Jul 4, 2006

Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device

HITACHI CHEMICAL CO LTD46 citations91

US7947779B2May 24, 2011

Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer

HITACHI CHEMICAL CO LTD3 citations61

US11827789B2Nov 28, 2023

Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof

HITACHI CHEMICAL CO LTD0 citations60

US11331888B2May 17, 2022

Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor

HITACHI CHEMICAL CO LTD0 citations60

US9212298B2Dec 15, 2015

Adhesive sheet and method for manufacturing semiconductor device

HITACHI CHEMICAL CO LTD0 citations42

SHIBATA TOMOAKI

1 patent

US8200059B2Jun 12, 2012

Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them

SHIBATA TOMOAKI2 citations60

INADA TEIICHI

1 patent

US8119737B2Feb 21, 2012

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

INADA TEIICHI2 citations59