Inventor
KURIYA HIROYUKI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “KURIYA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
12 patentsUS5449480ASep 12, 1995
Method of producing boards for printed wiring
HITACHI CHEMICAL CO LTD182 citations98
US6265782B1Jul 24, 2001
Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
HITACHI CHEMICAL CO LTD99 citations97
US6673441B1Jan 6, 2004
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
HITACHI CHEMICAL CO LTD55 citations96
US6838170B2Jan 4, 2005
Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
HITACHI CHEMICAL CO LTD24 citations92
US6621170B2Sep 16, 2003
Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
HITACHI CHEMICAL CO LTD29 citations92
US5319005AJun 7, 1994
Epoxy resin molding material for sealing of electronic component
HITACHI CHEMICAL CO LTD32 citations92
US7239013B2Jul 3, 2007
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
HITACHI CHEMICAL CO LTD16 citations91
US7070670B2Jul 4, 2006
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
HITACHI CHEMICAL CO LTD46 citations91
US7700185B2Apr 20, 2010
Insulation material, film, circuit board and method of producing them
HITACHI CHEMICAL CO LTD9 citations84
US7592250B2Sep 22, 2009
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
HITACHI CHEMICAL CO LTD10 citations82
US6889431B2May 10, 2005
Manufacturing method of electronic circuit including multilayer circuit board
HITACHI CHEMICAL CO LTD11 citations73
US7947779B2May 24, 2011
Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
HITACHI CHEMICAL CO LTD3 citations61