Inventor
YOO CHEOL-JOON
KR11 patents
Patents
11 patentsUS7170158B2Jan 30, 2007
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
SAMSUNG ELECTRONICS CO LTD73 citations97
US7298033B2Nov 20, 2007
Stack type ball grid array package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD93 citations96
US6869264B2Mar 22, 2005
Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
SAMSUNG ELECTRONICS CO LTD14 citations91
US7129585B2Oct 31, 2006
Semiconductor device and method of packaging the same
SAMSUNG ELECTRONICS CO LTD15 citations83
US7129118B2Oct 31, 2006
Protective tape removing apparatus and method of assembling semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD11 citations82
US7939924B2May 10, 2011
Stack type ball grid array package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US7465142B2Dec 16, 2008
Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
SAMSUNG ELECTRONICS CO LTD7 citations72
US7284941B2Oct 23, 2007
Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
SAMSUNG ELECTRONICS CO LTD9 citations72
US6808379B2Oct 26, 2004
Cleaner for molding apparatus of semiconductor chip packages
SAMSUNG ELECTRONICS CO LTD8 citations72
US7485959B2Feb 3, 2009
Structure for joining a semiconductor package to a substrate using a solder column
SAMSUNG ELECTRONICS CO LTD2 citations61
US7279360B2Oct 9, 2007
Semiconductor device and method of packaging the same
SAMSUNG ELECTRONICS CO LTD0 citations51