Inventor
JEONG KI-KWON
KR11 patents
⚠️ This page may combine multiple inventors who share the name “JEONG KI-KWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7494845B2Feb 24, 2009
Method of forming a thin wafer stack for a wafer level package
SAMSUNG ELECTRONICS CO LTD247 citations97
US7294531B2Nov 13, 2007
Wafer level chip stack method
SAMSUNG ELECTRONICS CO LTD44 citations91
US7051428B2May 30, 2006
In line system used in a semiconductor package assembling
SAMSUNG ELECTRONICS CO LTD18 citations83
US7129118B2Oct 31, 2006
Protective tape removing apparatus and method of assembling semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD11 citations82
US5898226AApr 27, 1999
Semiconductor chip having a bonding window smaller than a wire ball
SAMSUNG ELECTRONICS CO LTD16 citations72
US7479455B2Jan 20, 2009
Method for manufacturing semiconductor wafer
SAMSUNG ELECTRONICS CO LTD3 citations61
US6923077B2Aug 2, 2005
Apparatus and method for wafer backside inspection
SAMSUNG ELECTRONICS CO LTD4 citations56
US7262114B2Aug 28, 2007
Die attaching method of semiconductor chip using warpage prevention material
SAMSUNG ELECTRONICS CO LTD1 citations50