Inventor

IKEZAWA RYOICHI

JP4 patents

Patents

4 patents

US7544727B2Jun 9, 2009

Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate

HITACHI CHEMICAL CO LTD31 citations90

US7397139B2Jul 8, 2008

Epoxy resin molding material for sealing use and semiconductor device

HITACHI CHEMICAL CO LTD33 citations87

US5066691ANov 19, 1991

Adhesive composition for metal-clad laminates

HITACHI CHEMICAL CO LTD8 citations67

US10662315B2May 26, 2020

Epoxy resin molding material for sealing and electronic component device

HITACHI CHEMICAL CO LTD0 citations38