Inventor

KONCHADY MANOHAR S

US6 patents

⚠️ This page may combine multiple inventors who share the name “KONCHADY MANOHAR S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents

US11443970B2Sep 13, 2022

Methods of forming a package substrate

INTEL CORP1 citations72

US10629469B2Apr 21, 2020

Solder resist layers for coreless packages and methods of fabrication

INTEL CORP4 citations72

US9312237B2Apr 12, 2016

Integrated circuit package with spatially varied solder resist opening dimension

INTEL CORP2 citations58

KONCHADY MANOHAR S

2 patents

US9704735B2Jul 11, 2017

Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication

KONCHADY MANOHAR S21 citations91

US8907461B1Dec 9, 2014

Heat dissipation device embedded within a microelectronic die

KONCHADY MANOHAR S0 citations48

ZHENG TIEYU

1 patent

US8952532B2Feb 10, 2015

Integrated circuit package with spatially varied solder resist opening dimension

ZHENG TIEYU7 citations77