Inventor
DIMAANO JR ANTONIO B
SG26 patents
⚠️ This page may combine multiple inventors who share the name “DIMAANO JR ANTONIO B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
16 patentsUS6969640B1Nov 29, 2005
Air pocket resistant semiconductor package system
STATS CHIPPAC LTD56 citations95
US7385299B2Jun 10, 2008
Stackable integrated circuit package system with multiple interconnect interface
STATS CHIPPAC LTD31 citations93
US7830020B2Nov 9, 2010
Integrated circuit package system employing device stacking
STATS CHIPPAC LTD19 citations92
US7556987B2Jul 7, 2009
Method of fabricating an integrated circuit with etched ring and die paddle
STATS CHIPPAC LTD24 citations92
US7141886B2Nov 28, 2006
Air pocket resistant semiconductor package
STATS CHIPPAC LTD21 citations91
US7986043B2Jul 26, 2011
Integrated circuit package on package system
STATS CHIPPAC LTD11 citations84
US7892894B2Feb 22, 2011
Method of manufacturing integrated circuit package system with warp-free chip
STATS CHIPPAC LTD8 citations84
US7545032B2Jun 9, 2009
Integrated circuit package system with stiffener
STATS CHIPPAC LTD8 citations84
US7479692B2Jan 20, 2009
Integrated circuit package system with heat sink
STATS CHIPPAC LTD13 citations84
US7936055B2May 3, 2011
Integrated circuit package system with interlock
STATS CHIPPAC LTD4 citations63
US7777320B2Aug 17, 2010
Quad flat pack in quad flat pack integrated circuit package system
STATS CHIPPAC LTD4 citations63
US7741707B2Jun 22, 2010
Stackable integrated circuit package system
STATS CHIPPAC LTD4 citations63
US7863108B2Jan 4, 2011
Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
STATS CHIPPAC LTD4 citations62
US7541222B2Jun 2, 2009
Wire sweep resistant semiconductor package and manufacturing method therefor
STATS CHIPPAC LTD5 citations61
US7928540B2Apr 19, 2011
Integrated circuit package system
STATS CHIPPAC LTD1 citations52
US7482683B2Jan 27, 2009
Integrated circuit encapsulation system with vent
STATS CHIPPAC LTD0 citations48
CHOW SENG GUAN
3 patentsUS8106500B2Jan 31, 2012
Stackable integrated circuit package system
CHOW SENG GUAN28 citations92
US8422243B2Apr 16, 2013
Integrated circuit package system employing a support structure with a recess
CHOW SENG GUAN5 citations73
US8232658B2Jul 31, 2012
Stackable integrated circuit package system with multiple interconnect interface
CHOW SENG GUAN4 citations63