Inventor
SUZUKI SHINSUKE
JP36 patents
⚠️ This page may combine multiple inventors who share the name “SUZUKI SHINSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HAMAMATSU PHOTONICS KK
7 patentsUS10923404B2Feb 16, 2021
Inspection method, inspection device, and marking forming method
HAMAMATSU PHOTONICS KK2 citations73
US10312166B2Jun 4, 2019
Inspection system and inspection method
HAMAMATSU PHOTONICS KK4 citations73
US10586743B2Mar 10, 2020
Inspection method, inspection device, and marking forming method
HAMAMATSU PHOTONICS KK1 citations62
US12203974B2Jan 21, 2025
Semiconductor fault analysis device and semiconductor fault analysis method
HAMAMATSU PHOTONICS KK0 citations59
US12117480B2Oct 15, 2024
Semiconductor failure analysis device and semiconductor failure analysis method
HAMAMATSU PHOTONICS KK0 citations59
US11971364B2Apr 30, 2024
Semiconductor device inspection method and semiconductor device inspection device
HAMAMATSU PHOTONICS KK0 citations52
US10607900B2Mar 31, 2020
Inspection system and inspection method
HAMAMATSU PHOTONICS KK0 citations52
HITACHI LTD
4 patentsUS6577634B1Jun 10, 2003
Method for sharing network information and a router apparatus
HITACHI LTD78 citations97
US7623517B2Nov 24, 2009
Multicast packet forwarding equipment
HITACHI LTD18 citations92
US7328014B2Feb 5, 2008
Communication system, gateway equipment, communication method and authentication method
HITACHI LTD22 citations92
US7805605B2Sep 28, 2010
Server, terminal control device and terminal authentication method
HITACHI LTD12 citations84
OKI ELECTRIC IND CO LTD
4 patentsUS6882056B2Apr 19, 2005
Multi-chip package type semiconductor device
OKI ELECTRIC IND CO LTD21 citations91
US7115977B2Oct 3, 2006
Multi-chip package type semiconductor device
OKI ELECTRIC IND CO LTD12 citations82
US6762490B2Jul 13, 2004
Semiconductor device and method for producing the same
OKI ELECTRIC IND CO LTD7 citations74
US7469812B2Dec 30, 2008
Wire bonding apparatus
OKI ELECTRIC IND CO LTD1 citations52
ALAXALA NETWORKS CORP
4 patentsUS7917621B2Mar 29, 2011
Method and system for network access control
ALAXALA NETWORKS CORP14 citations83
US8023448B2Sep 20, 2011
Packet relay apparatus
ALAXALA NETWORKS CORP3 citations63
US7715390B2May 11, 2010
Multicast path building method and device
ALAXALA NETWORKS CORP3 citations63
US7788721B2Aug 31, 2010
Traffic control method, apparatus, and system
ALAXALA NETWORKS CORP3 citations60
MITSUBISHI ELECTRIC CORP
3 patentsSUZUKI SHINSUKE
3 patentsOKI SEMICONDUCTOR CO LTD
3 patentsUS8053278B2Nov 8, 2011
Multi-chip package type semiconductor device
OKI SEMICONDUCTOR CO LTD6 citations72
US7810703B2Oct 12, 2010
Wire bonding method
OKI SEMICONDUCTOR CO LTD0 citations52
US7709351B2May 4, 2010
Method of manufacturing semiconductor device and method of manufacturing bonding sheet
OKI SEMICONDUCTOR CO LTD0 citations52
DAICEL CHEM
3 patentsUS6736967B2May 18, 2004
Separating agent for enantiomeric isomers
DAICEL CHEM10 citations72
US6803458B2Oct 12, 2004
Cellulose acetates and process for producing the cellulose acetates
DAICEL CHEM11 citations71
US7407576B2Aug 5, 2008
Separating agent for an optical enantiomeric isomer
DAICEL CHEM2 citations63