Inventor
BOYD PHILLIP R
US3 patents
Patents
3 patentsUS4875004AOct 17, 1989
High speed semiconductor characterization technique
US ARMY14 citations68
US4436580AMar 13, 1984
Method of preparing a mercury cadium telluride substrate for passivation and processing
US ARMY10 citations65
US6861208B2Mar 1, 2005
Fullerene addition in photoresist via incorporation in the developer
US ARMY4 citations50