P

Inventor

KOZAWA MIWA

JP46 patents
⚠️ This page may combine multiple inventors who share the name “KOZAWA MIWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

32 patents
US7608386B2Oct 27, 2009

Resist cover film-forming material, process for forming resist pattern, semiconductor device and process for manufacturing the same

FUJITSU LTD79 citations98
US6342562B1Jan 29, 2002

Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method

FUJITSU LTD41 citations96
US6770417B2Aug 3, 2004

Negative resist composition, process for forming resist patterns, and process for manufacturing electron device

FUJITSU LTD20 citations93
US6541077B1Apr 1, 2003

Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method

FUJITSU LTD16 citations93
US7338750B2Mar 4, 2008

Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereof

FUJITSU LTD25 citations92
US7189783B2Mar 13, 2007

Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof

FUJITSU LTD13 citations92
US6506534B1Jan 14, 2003

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

FUJITSU LTD29 citations92
US7585610B2Sep 8, 2009

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same

FUJITSU LTD9 citations84
US7416837B2Aug 26, 2008

Resist pattern-improving material and a method for preparing a resist pattern by using the same

FUJITSU LTD11 citations84
US7592127B2Sep 22, 2009

Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same

FUJITSU LTD7 citations74
US7488569B2Feb 10, 2009

Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor device

FUJITSU LTD5 citations74
US6794112B2Sep 21, 2004

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

FUJITSU LTD4 citations74
US6773867B2Aug 10, 2004

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

FUJITSU LTD7 citations74
US6949324B2Sep 27, 2005

Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the same

FUJITSU LTD7 citations72
US8945822B2Feb 3, 2015

Resist pattern thickening material, method for forming resist pattern, semiconductor device and method for manufacturing the same

FUJITSU LTD2 citations63
US8349542B2Jan 8, 2013

Manufacturing process of semiconductor device

FUJITSU LTD2 citations63
US7820367B2Oct 26, 2010

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same

FUJITSU LTD4 citations63
US7799508B2Sep 21, 2010

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same

FUJITSU LTD3 citations63
US7744768B2Jun 29, 2010

Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof

FUJITSU LTD3 citations63
US7662539B2Feb 16, 2010

Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device

FUJITSU LTD6 citations63
US7625688B2Dec 1, 2009

Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same

FUJITSU LTD4 citations63
US7550248B2Jun 23, 2009

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same

FUJITSU LTD4 citations63
US7361448B2Apr 22, 2008

Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the same

FUJITSU LTD3 citations63
US7144968B2Dec 5, 2006

Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method

FUJITSU LTD4 citations63
US7122288B2Oct 17, 2006

Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor device

FUJITSU LTD4 citations63
US6794113B2Sep 21, 2004

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

FUJITSU LTD3 citations63
US6787288B2Sep 7, 2004

Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices

FUJITSU LTD2 citations63
US6465137B2Oct 15, 2002

Resist composition and pattern forming process

FUJITSU LTD5 citations62
US7439010B2Oct 21, 2008

Alkali-soluble siloxane polymer, positive type resist composition, resist pattern, process for forming the same, electronic device and process for manufacturing the same

FUJITSU LTD2 citations61
US7611819B2Nov 3, 2009

Resist composition, method for forming resist pattern, and semiconductor device and method for manufacturing the same

FUJITSU LTD0 citations52
US7452657B2Nov 18, 2008

Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof

FUJITSU LTD1 citations52
US7364829B2Apr 29, 2008

Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device

FUJITSU LTD0 citations52

KOZAWA MIWA

11 patents
US8906598B2Dec 9, 2014

Pattern forming method, method for manufacturing semiconductor device, and material for forming coating layer of resist pattern

KOZAWA MIWA3 citations62
US8795949B2Aug 5, 2014

Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor device

KOZAWA MIWA2 citations62
US8338080B2Dec 25, 2012

Process for forming resist pattern, semiconductor device and fabrication thereof

KOZAWA MIWA4 citations62
US8198014B2Jun 12, 2012

Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same

KOZAWA MIWA2 citations62
US8129092B2Mar 6, 2012

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the same

KOZAWA MIWA3 citations62
US8119325B2Feb 21, 2012

Method for forming resist pattern, semiconductor device and production method thereof

KOZAWA MIWA3 citations62
US8980535B2Mar 17, 2015

Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor device

KOZAWA MIWA0 citations52
US8945816B2Feb 3, 2015

Method for forming resist pattern, semiconductor device and production method thereof

KOZAWA MIWA0 citations52
US8652751B2Feb 18, 2014

Resist composition, method for forming resist pattern, and method for producing electronic device

KOZAWA MIWA0 citations52
US8198009B2Jun 12, 2012

Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same

KOZAWA MIWA0 citations52
US8476346B2Jul 2, 2013

Resist pattern thickening material, semiconductor device, and production method thereof

KOZAWA MIWA0 citations41

NOZAKI KOJI

3 patents