P

Inventor

DE LARIOS JOHN M

US58 patents
⚠️ This page may combine multiple inventors who share the name “DE LARIOS JOHN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

42 patents
US6988327B2Jan 24, 2006

Methods and systems for processing a substrate using a dynamic liquid meniscus

LAM RES CORP164 citations99
US7367345B1May 6, 2008

Apparatus and method for providing a confined liquid for immersion lithography

LAM RES CORP62 citations98
US6594847B1Jul 22, 2003

Single wafer residue, thin film removal and clean

LAM RES CORP112 citations97
US6303551B1Oct 16, 2001

Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film

LAM RES CORP55 citations96
US7234477B2Jun 26, 2007

Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP55 citations95
US7000622B2Feb 21, 2006

Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus

LAM RES CORP50 citations94
US7153400B2Dec 26, 2006

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

LAM RES CORP33 citations93
US7389783B2Jun 24, 2008

Proximity meniscus manifold

LAM RES CORP24 citations92
US7383843B2Jun 10, 2008

Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer

LAM RES CORP28 citations92
US6593282B1Jul 15, 2003

Cleaning solutions for semiconductor substrates after polishing of copper film

LAM RES CORP21 citations92
US6294027B1Sep 25, 2001

Methods and apparatus for cleaning semiconductor substrates after polishing of copper film

LAM RES CORP26 citations92
US6622335B1Sep 23, 2003

Drip manifold for uniform chemical delivery

LAM RES CORP32 citations91
US7862662B2Jan 4, 2011

Method and material for cleaning a substrate

LAM RES CORP10 citations84
US7799141B2Sep 21, 2010

Method and system for using a two-phases substrate cleaning compound

LAM RES CORP8 citations84
US7749689B2Jul 6, 2010

Methods for providing a confined liquid for immersion lithography

LAM RES CORP13 citations84
US7737097B2Jun 15, 2010

Method for removing contamination from a substrate and for making a cleaning solution

LAM RES CORP11 citations84
US7696141B2Apr 13, 2010

Cleaning compound and method and system for using the cleaning compound

LAM RES CORP10 citations84
US7648584B2Jan 19, 2010

Method and apparatus for removing contamination from substrate

LAM RES CORP9 citations84
US7584761B1Sep 8, 2009

Wafer edge surface treatment with liquid meniscus

LAM RES CORP10 citations84
US7252097B2Aug 7, 2007

System and method for integrating in-situ metrology within a wafer process

LAM RES CORP18 citations84
US7395611B2Jul 8, 2008

System processing a substrate using dynamic liquid meniscus

LAM RES CORP7 citations74
US7387689B2Jun 17, 2008

Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP6 citations74
US7383601B2Jun 10, 2008

Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same

LAM RES CORP7 citations74
US7127831B2Oct 31, 2006

Methods and systems for processing a substrate using a dynamic liquid meniscus

LAM RES CORP9 citations74
US7045018B2May 16, 2006

Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same

LAM RES CORP9 citations74
US7913703B1Mar 29, 2011

Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate

LAM RES CORP6 citations73
US6261407B1Jul 17, 2001

Method and apparatus for removal of thin films from wafers

LAM RES CORP10 citations73
US6611326B1Aug 26, 2003

System and apparatus for evaluating the effectiveness of wafer drying operations

LAM RES CORP7 citations71
US6521050B1Feb 18, 2003

Methods for evaluating advanced wafer drying techniques

LAM RES CORP9 citations71
US7947157B2May 24, 2011

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

LAM RES CORP5 citations63
US7591613B2Sep 22, 2009

Method and apparatus for transporting a substrate using non-newtonian fluid

LAM RES CORP3 citations63
US7416370B2Aug 26, 2008

Method and apparatus for transporting a substrate using non-Newtonian fluid

LAM RES CORP2 citations63
US8043441B2Oct 25, 2011

Method and apparatus for cleaning a substrate using non-Newtonian fluids

LAM RES CORP4 citations62
US7625452B2Dec 1, 2009

Apparatuses and methods for cleaning a substrate

LAM RES CORP2 citations62
US7614411B2Nov 10, 2009

Controls of ambient environment during wafer drying using proximity head

LAM RES CORP2 citations62
US7441299B2Oct 28, 2008

Apparatuses and methods for cleaning a substrate

LAM RES CORP3 citations62
US7806126B1Oct 5, 2010

Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the same

LAM RES CORP5 citations61
US7192488B2Mar 20, 2007

Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus

LAM RES CORP3 citations61
US7897213B2Mar 1, 2011

Methods for contained chemical surface treatment

LAM RES CORP0 citations52
US7568490B2Aug 4, 2009

Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids

LAM RES CORP0 citations52
US8726919B2May 20, 2014

Method and system for uniformly applying a multi-phase cleaning solution to a substrate

LAM RES CORP0 citations51
US7534307B2May 19, 2009

Methods for processing wafer surfaces using thin, high velocity fluid layer

LAM RES CORP1 citations51

FREER ERIK M

6 patents

DE LARIOS JOHN M

1 patent

KOROLIK MIKHAIL

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.