Inventor
TSAI STAN
US26 patents
⚠️ This page may combine multiple inventors who share the name “TSAI STAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
19 patentsUS6309276B1Oct 30, 2001
Endpoint monitoring with polishing rate change
APPLIED MATERIALS INC85 citations98
US6299741B1Oct 9, 2001
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
APPLIED MATERIALS INC110 citations98
US6863797B2Mar 8, 2005
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
APPLIED MATERIALS INC45 citations96
US6709316B1Mar 23, 2004
Method and apparatus for two-step barrier layer polishing
APPLIED MATERIALS INC64 citations96
US6541384B1Apr 1, 2003
Method of initiating cooper CMP process
APPLIED MATERIALS INC54 citations96
US6524167B1Feb 25, 2003
Method and composition for the selective removal of residual materials and barrier materials during substrate planarization
APPLIED MATERIALS INC72 citations96
US7104869B2Sep 12, 2006
Barrier removal at low polish pressure
APPLIED MATERIALS INC26 citations93
US6858540B2Feb 22, 2005
Selective removal of tantalum-containing barrier layer during metal CMP
APPLIED MATERIALS INC21 citations93
US6869498B1Mar 22, 2005
Chemical mechanical polishing with shear force measurement
APPLIED MATERIALS INC18 citations92
US6669538B2Dec 30, 2003
Pad cleaning for a CMP system
APPLIED MATERIALS INC32 citations92
US6863794B2Mar 8, 2005
Method and apparatus for forming metal layers
APPLIED MATERIALS INC18 citations84
US7125477B2Oct 24, 2006
Contacts for electrochemical processing
APPLIED MATERIALS INC14 citations82
US7022608B2Apr 4, 2006
Method and composition for the removal of residual materials during substrate planarization
APPLIED MATERIALS INC10 citations74
US7569134B2Aug 4, 2009
Contacts for electrochemical processing
APPLIED MATERIALS INC5 citations72
US7384534B2Jun 10, 2008
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
APPLIED MATERIALS INC2 citations63
US7232363B2Jun 19, 2007
Polishing solution retainer
APPLIED MATERIALS INC2 citations63
US7077725B2Jul 18, 2006
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
APPLIED MATERIALS INC3 citations63
US7303662B2Dec 4, 2007
Contacts for electrochemical processing
APPLIED MATERIALS INC4 citations61
US7842169B2Nov 30, 2010
Method and apparatus for local polishing control
APPLIED MATERIALS INC0 citations52
GLOBALFOUNDRIES INC
4 patentsUS9812365B1Nov 7, 2017
Methods of cutting gate structures on transistor devices
GLOBALFOUNDRIES INC26 citations94
US10134633B1Nov 20, 2018
Self-aligned contact with CMP stop layer
GLOBALFOUNDRIES INC8 citations84
US9865543B1Jan 9, 2018
Structure and method for inhibiting cobalt diffusion
GLOBALFOUNDRIES INC4 citations71
US10593599B2Mar 17, 2020
Contact structures
GLOBALFOUNDRIES INC0 citations52