Inventor
NULMAN JAIM
US45 patents
⚠️ This page may combine multiple inventors who share the name “NULMAN JAIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
40 patentsUS6303395B1Oct 16, 2001
Semiconductor processing techniques
APPLIED MATERIALS INC142 citations99
US6217721B1Apr 17, 2001
Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer
APPLIED MATERIALS INC206 citations99
US5754297AMay 19, 1998
Method and apparatus for monitoring the deposition rate of films during physical vapor deposition
APPLIED MATERIALS INC146 citations99
US5250467AOct 5, 1993
Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer
APPLIED MATERIALS INC116 citations98
US5236868AAug 17, 1993
Formation of titanium nitride on semiconductor wafer by reaction of titanium with nitrogen-bearing gas in an integrated processing system
APPLIED MATERIALS INC133 citations98
US5043300AAug 27, 1991
Single anneal step process for forming titanium silicide on semiconductor wafer
APPLIED MATERIALS INC126 citations98
US6506009B1Jan 14, 2003
Apparatus for storing and moving a cassette
APPLIED MATERIALS INC525 citations97
US6456894B1Sep 24, 2002
Semiconductor processing techniques
APPLIED MATERIALS INC57 citations96
US6408220B1Jun 18, 2002
Semiconductor processing techniques
APPLIED MATERIALS INC66 citations96
US6368469B1Apr 9, 2002
Coils for generating a plasma and for sputtering
APPLIED MATERIALS INC48 citations96
US6001227ADec 14, 1999
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target
APPLIED MATERIALS INC40 citations96
US5747360AMay 5, 1998
Method of metalizing a semiconductor wafer
APPLIED MATERIALS INC43 citations96
US5460689AOct 24, 1995
High pressure plasma treatment method and apparatus
APPLIED MATERIALS INC66 citations96
US5460703AOct 24, 1995
Low thermal expansion clamping mechanism
APPLIED MATERIALS INC55 citations96
US5288665AFeb 22, 1994
Process for forming low resistance aluminum plug in via electrically connected to overlying patterned metal layer for integrated circuit structures
APPLIED MATERIALS INC55 citations96
US5098198AMar 24, 1992
Wafer heating and monitor module and method of operation
APPLIED MATERIALS INC92 citations96
US5434044AJul 18, 1995
Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
APPLIED MATERIALS INC41 citations95
US5242860ASep 7, 1993
Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
APPLIED MATERIALS INC91 citations95
US6955517B2Oct 18, 2005
Apparatus for storing and moving a cassette
APPLIED MATERIALS INC59 citations94
US6654698B2Nov 25, 2003
Systems and methods for calibrating integrated inspection tools
APPLIED MATERIALS INC26 citations93
US6572321B1Jun 3, 2003
Loader conveyor for substrate processing system
APPLIED MATERIALS INC40 citations93
US6514390B1Feb 4, 2003
Method to eliminate coil sputtering in an ICP source
APPLIED MATERIALS INC42 citations93
US6361618B1Mar 26, 2002
Methods and apparatus for forming and maintaining high vacuum environments
APPLIED MATERIALS INC21 citations93
US6231725B1May 15, 2001
Apparatus for sputtering material onto a workpiece with the aid of a plasma
APPLIED MATERIALS INC41 citations93
US6046100AApr 4, 2000
Method of fabricating a fabricating plug and near-zero overlap interconnect line
APPLIED MATERIALS INC27 citations93
US5759360AJun 2, 1998
Wafer clean sputtering process
APPLIED MATERIALS INC51 citations93
US5443995AAug 22, 1995
Method for metallizing a semiconductor wafer
APPLIED MATERIALS INC45 citations93
US6783639B2Aug 31, 2004
Coils for generating a plasma and for sputtering
APPLIED MATERIALS INC21 citations92
US6228186B1May 8, 2001
Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies
APPLIED MATERIALS INC23 citations92
US6171455B1Jan 9, 2001
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target
APPLIED MATERIALS INC15 citations92
US5360996ANov 1, 1994
Titanium nitride/titanium silicide multiple layer barrier with preferential (111) crystallographic orientation on titanium nitride surface
APPLIED MATERIALS INC29 citations92
US7234908B2Jun 26, 2007
Apparatus for storing and moving a cassette
APPLIED MATERIALS INC34 citations91
US5521120AMay 28, 1996
Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
APPLIED MATERIALS INC40 citations91
US6608495B2Aug 19, 2003
Eddy-optic sensor for object inspection
APPLIED MATERIALS INC15 citations90
US6126791AOct 3, 2000
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target
APPLIED MATERIALS INC12 citations82
US5356835AOct 18, 1994
Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer
APPLIED MATERIALS INC17 citations82
US6583509B2Jun 24, 2003
Semiconductor processing techniques
APPLIED MATERIALS INC12 citations74
US5904562AMay 18, 1999
Method of metallizing a semiconductor wafer
APPLIED MATERIALS INC15 citations74
US7042558B1May 9, 2006
Eddy-optic sensor for object inspection
APPLIED MATERIALS INC9 citations71
US6455921B1Sep 24, 2002
Fabricating plug and near-zero overlap interconnect line
APPLIED MATERIALS INC4 citations63
PROCESSING TECHNOLOGIES INC AG
3 patentsUS4919542AApr 24, 1990
Emissivity correction apparatus and method
PROCESSING TECHNOLOGIES INC AG158 citations96
US4854727AAug 8, 1989
Emissivity calibration apparatus and method
PROCESSING TECHNOLOGIES INC AG40 citations92
US4989991AFeb 5, 1991
Emissivity calibration apparatus and method
PROCESSING TECHNOLOGIES INC AG17 citations73