Inventor
WIDODO JOHNNY
SG21 patents
⚠️ This page may combine multiple inventors who share the name “WIDODO JOHNNY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
6 patentsUS7524755B2Apr 28, 2009
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
CHARTERED SEMICONDUCTOR MFG37 citations91
US7566656B2Jul 28, 2009
Method and apparatus for providing void structures
CHARTERED SEMICONDUCTOR MFG17 citations84
US7622403B2Nov 24, 2009
Semiconductor processing system with ultra low-K dielectric
CHARTERED SEMICONDUCTOR MFG2 citations60
US7795680B2Sep 14, 2010
Integrated circuit system employing selective epitaxial growth technology
CHARTERED SEMICONDUCTOR MFG0 citations51
US7767577B2Aug 3, 2010
Nested and isolated transistors with reduced impedance difference
CHARTERED SEMICONDUCTOR MFG0 citations51
US7829422B2Nov 9, 2010
Integrated circuit having ultralow-K dielectric layer
CHARTERED SEMICONDUCTOR MFG0 citations49
SAMSUNG ELECTRONICS CO LTD
6 patentsUS7923365B2Apr 12, 2011
Methods of forming field effect transistors having stress-inducing sidewall insulating spacers thereon
SAMSUNG ELECTRONICS CO LTD4 citations62
US7541288B2Jun 2, 2009
Methods of forming integrated circuit structures using insulator deposition and insulator gap filling techniques
SAMSUNG ELECTRONICS CO LTD2 citations62
US7838390B2Nov 23, 2010
Methods of forming integrated circuit devices having ion-cured electrically insulating layers therein
SAMSUNG ELECTRONICS CO LTD4 citations60
US7687381B2Mar 30, 2010
Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewall
SAMSUNG ELECTRONICS CO LTD4 citations60
US7737029B2Jun 15, 2010
Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby
SAMSUNG ELECTRONICS CO LTD0 citations52
US7459388B2Dec 2, 2008
Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses
SAMSUNG ELECTRONICS CO LTD1 citations45
GLOBALFOUNDRIES SG PTE LTD
4 patentsUS8053327B2Nov 8, 2011
Method of manufacture of an integrated circuit system with self-aligned isolation structures
GLOBALFOUNDRIES SG PTE LTD3 citations62
US7999300B2Aug 16, 2011
Memory cell structure and method for fabrication thereof
GLOBALFOUNDRIES SG PTE LTD0 citations52
US7906426B2Mar 15, 2011
Method of controlled low-k via etch for Cu interconnections
GLOBALFOUNDRIES SG PTE LTD0 citations45
US7932178B2Apr 26, 2011
Integrated circuit having a plurality of MOSFET devices
GLOBALFOUNDRIES SG PTE LTD0 citations41