Inventor
INAO YOSHIHIRO
JP39 patents
⚠️ This page may combine multiple inventors who share the name “INAO YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
22 patentsUSD552565SOct 9, 2007
Supporting plate
TOKYO OHKA KOGYO CO LTD69 citations98
USD544452SJun 12, 2007
Supporting plate
TOKYO OHKA KOGYO CO LTD50 citations96
US7268061B2Sep 11, 2007
Substrate attaching method
TOKYO OHKA KOGYO CO LTD25 citations92
US9308715B2Apr 12, 2016
Laminate and method for separating the same
TOKYO OHKA KOGYO CO LTD10 citations84
US7919394B2Apr 5, 2011
Method for thinning substrate and method for manufacturing circuit device
TOKYO OHKA KOGYO CO LTD11 citations84
US8882096B2Nov 11, 2014
Perforated support plate
TOKYO OHKA KOGYO CO LTD7 citations83
US9627235B2Apr 18, 2017
Supporting member separation method
TOKYO OHKA KOGYO CO LTD4 citations72
US9238357B2Jan 19, 2016
Supporting member separation apparatus and supporting member separation method
TOKYO OHKA KOGYO CO LTD2 citations63
US6893172B2May 17, 2005
Developing apparatus and developing method
TOKYO OHKA KOGYO CO LTD6 citations63
US9352542B2May 31, 2016
Processing method and processing apparatus
TOKYO OHKA KOGYO CO LTD2 citations57
US9272494B2Mar 1, 2016
Sticking apparatus and sticking method
TOKYO OHKA KOGYO CO LTD1 citations52
US8354157B2Jan 15, 2013
Support plate, method for producing the same, and method for processing substrate
TOKYO OHKA KOGYO CO LTD0 citations52
US7999052B2Aug 16, 2011
Process for producing an adhesive composition
TOKYO OHKA KOGYO CO LTD0 citations52
US7849905B2Dec 14, 2010
Stripping device and stripping apparatus
TOKYO OHKA KOGYO CO LTD1 citations52
US7237967B2Jul 3, 2007
Developing apparatus and method
TOKYO OHKA KOGYO CO LTD0 citations52
US8377256B2Feb 19, 2013
Stripping device and stripping method
TOKYO OHKA KOGYO CO LTD1 citations49
US9337074B2May 10, 2016
Attaching device and attaching method
TOKYO OHKA KOGYO CO LTD0 citations47
US9281225B2Mar 8, 2016
Substrate processing apparatus and substrate processing method
TOKYO OHKA KOGYO CO LTD0 citations42
US9484238B2Nov 1, 2016
Attachment method
TOKYO OHKA KOGYO CO LTD0 citations41
US9653337B2May 16, 2017
Transport arm, transport apparatus and transport method
TOKYO OHKA KOGYO CO LTD0 citations40
US9548232B2Jan 17, 2017
Attaching apparatus
TOKYO OHKA KOGYO CO LTD0 citations40
US9962915B2May 8, 2018
Bonding method and bonding apparatus
TOKYO OHKA KOGYO CO LTD0 citations37
NAKAMURA AKIHIKO
6 patentsUS8167687B2May 1, 2012
Method of thinning wafer and support plate
NAKAMURA AKIHIKO3 citations62
US8136564B2Mar 20, 2012
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
NAKAMURA AKIHIKO5 citations62
US8080123B2Dec 20, 2011
Supporting plate, apparatus and method for stripping supporting plate
NAKAMURA AKIHIKO5 citations62
US8186410B2May 29, 2012
Separating device
NAKAMURA AKIHIKO2 citations61
US8931535B2Jan 13, 2015
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
NAKAMURA AKIHIKO0 citations52
US8449691B2May 28, 2013
Liquid solvent abutment unit
NAKAMURA AKIHIKO1 citations51
INAO YOSHIHIRO
4 patentsUS9048311B2Jun 2, 2015
Laminate and method for separating the same
INAO YOSHIHIRO4 citations71
US9492986B2Nov 15, 2016
Laminate and method for separating the same
INAO YOSHIHIRO2 citations61
US8080121B2Dec 20, 2011
Method of bonding, thinning, and releasing wafer
INAO YOSHIHIRO5 citations61
US8297331B2Oct 30, 2012
Separating apparatus and separating method
INAO YOSHIHIRO0 citations40