Inventor

CHIA KAN-JUNG

TW17 patents

⚠️ This page may combine multiple inventors who share the name “CHIA KAN-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIA KAN-JUNG

PHOENIX PREC TECHNOLOGY CORP

Circuit board structure with embedded electronic components

Package structure having semiconductor chip embedded therein and method for fabricating the same

Package structure with circuits directly connected to semiconductor chip

Carrier structure embedded with semiconductor chip

Semiconductor package structure

Plate structure having chip embedded therein and the manufacturing method of the same

UNIMICRON TECHNOLOGY CORP

Method for fabricating packaging structure having embedded semiconductor element

Circuit board structure having electronic components integrated therein

Stacked semiconductor device and fabricating method thereof

Carrier structure embedded with semiconductor chips and method for manufacturing the same

Package substrate having embedded semiconductor chip and fabrication method thereof

Packaging substrate structure with a semiconductor chip embedded therein

CHIA KAN-JUNG

Packaging structure having embedded semiconductor element

Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof

Package substrate having semiconductor component embedded therein and fabrication method thereof

HSU SHIH-PING

Package substrate embedded with semiconductor component

HSU SHIN-PING

Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof