Inventor · disambiguated record
Tetsuro Miyao
Also filed as: MIYAO TETSURO
2 granted patents·2 pending applications·3 citations·filing 2014–2015
39Inventor score
Files withSEIKO EPSON CORP4
Top patents by PatentIndex Score
4 records- 0170US9954160B2Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Apr 24, 2018·3 cites·14 claims
- 0247US9769934B2Package base, package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Granted Sep 19, 2017·0 cites·12 claims
- 0341US2015070855A1Circuit board, method for manufacturing circuit board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 0429US2015223325A1Wiring board, method of manufacturing wiring board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →